Memory Module Pad Layout for Socket Compatibility

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Solution Overview

Problem

Existing memory modules have varying connection methods, requiring specific types of modules for different sockets, which can lead to compatibility issues and increased complexity in electronic device assemblies.

Innovation Solution

A memory module design featuring a module printed circuit board with distinct pad regions on both surfaces, where the first pads are positioned farther from the chip region than the second pads, allowing for improved connectivity and compatibility with different socket types.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If various types of memory modules have different connection methods for different sockets, then compatibility with different socket types is improved, but device complexity increases

Engineering Contradiction:

Improvecompatibility with different socket typesVSAvoidcomplexity in electronic device assemblies

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The memory module is designed with pad regions on both the first surface and second surface of the module printed circuit board, enabling it to connect to different socket types through multiple connection methods. This multi-functional design allows a single memory module to serve universal compatibility across various socket configurations without requiring different module types.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If memory modules are designed with specific connection methods for different sockets, then adaptability to various socket types is improved, but the force required for insertion increases

Engineering Contradiction:

Improvecompatibility with different socket typesVSAvoidforce required for insertion

Core Design Contradiction:

Adaptability or versatilityVSForce

Solution Approach 1:

The connection interface is segmented into multiple pad regions distributed across both surfaces of the module printed circuit board. This segmentation allows the connection force to be distributed across multiple contact points rather than concentrated at a single location, reducing the insertion force required while maintaining compatibility with different socket types.

Inventive Principle:

Principle #1Segmentation

3Productivity

If pads are positioned closer to the chip region, then connection efficiency is improved, but signal transmission efficiency deteriorates

Engineering Contradiction:

Improveconnection efficiencyVSAvoidsignal transmission efficiency

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

Different pad regions are positioned at different locations on the module printed circuit board with distinct functional characteristics. Some pad regions are positioned closer to the chip region for efficient connection, while other pad regions are positioned farther away to optimize signal transmission paths. This local differentiation allows each pad region to be optimized for its specific function, achieving both connection efficiency and signal transmission efficiency simultaneously.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250194006A1Memory module and electronic device assembly including the same

Publication Date: 2025.06.12 SAMSUNG ELECTRONICS CO LTD

AI summary

Disclosed is a memory module comprising a module printed circuit board including a chip region and a pad region and a memory chip provided on the module printed circuit board in the chip region. The module printed circuit board includes a board including a first surface and a second surface disposed opposite to each other, a first pad provided on the first surface in the pad region, and a second pad provided on the second surface in the pad region. The first pad is disposed farther from the chip region than the second pad.