Memory Module Power Sharing Across Adjacent Memory Devices

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Solution Overview

Problem

Existing dual in-line memory modules face challenges in uniformly providing power to multiple packages due to varying distances and performance differences, leading to inefficient power management.

Innovation Solution

A memory system with a substrate featuring first and second power lines, where memory devices share power through power management blocks and internal voltage generators, allowing adjacent devices to supply additional power when needed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single PMIC is used to supply power to multiple packages, then the power management structure is simplified, but the uniformity of power distribution deteriorates due to varying distances and performance differences

Engineering Contradiction:
Improvepower management structureVSAvoidpower distribution uniformity
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent divides the power management function into multiple power control circuits, each associated with specific packages. Instead of using a single PMIC for all packages, the system segments power management into distributed units that can independently regulate power for adjacent packages, ensuring uniform power distribution while maintaining manageable complexity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each power control circuit is designed to serve specific local packages with which it is adjacent. The power control circuits have different configurations and capabilities matched to the specific power requirements of their local packages, allowing each region to receive appropriately tailored power management

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If packages are placed at different distances from the PMIC, then the memory module layout flexibility is improved, but the power distribution uniformity deteriorates

Engineering Contradiction:
Improvememory module layout flexibilityVSAvoidpower distribution uniformity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The power control circuits act as intermediary devices between the power source and the memory packages. Each power control circuit receives power from a power line and regulates it before distributing to adjacent packages, serving as a local mediator that compensates for distance variations and ensures uniform power delivery regardless of package position

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent introduces a hierarchical power distribution structure where power flows from main power lines to intermediate power control circuits, and then to individual packages. This adds a dimensional layer to the power distribution system, allowing flexible package placement while maintaining power uniformity through the intermediate regulation stage

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Length of stationary object

If power is supplied through long distance power lines, then the power delivery range is improved, but the power loss and regulation precision deteriorate

Engineering Contradiction:
Improvepower line lengthVSAvoidpower regulation precision
Core Design Contradiction:
Length of stationary objectVSManufacturing precision

Solution Approach 1:

The power distribution network is segmented into multiple short segments, each managed by a power control circuit. Instead of one long power line from a single PMIC to all packages, the system uses multiple shorter power lines with intermediate regulation points, reducing cumulative power loss and improving regulation precision at each segment

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Power control circuits serve as intermediary regulation points along the power distribution path. These intermediaries refresh and regulate power at intermediate stages, preventing the accumulation of power losses over long distances and maintaining precise power regulation even as power lines extend across the memory module

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250342876A1Memory module including module substrate
Publication Date: 2025.11.06 SK HYNIX INC
  • US20250342876A1 patent drawing
  • US20250342876A1 patent drawing
  • US20250342876A1 patent drawing

AI summary

A memory module includes a module substrate, a plurality of memory devices, a first power line, and a second power line. The memory devices are mounted on the module substrate. Each of the memory devices includes a power management member. The first power line may be arranged in the module substrate to provide each of the memory devices with power. The second power line may be electrically connected between the power management members of adjacent memory devices to control and share the power provided to the adjacent memory devices.