Memory Module Thermal Management with Segmented Radiators

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Solution Overview

Problem

Conventional memory modules face reliability issues due to temperature rise in semiconductor memory packages near high-heat control semiconductor packages, as a single radiator fails to effectively cool both components without affecting the semiconductor memory packages.

Innovation Solution

A memory module design featuring separate thermally connected radiators for control and semiconductor memory packages, with a non-thermally connected gap between them, and radiation fins on the control semiconductor radiator for efficient heat dissipation, ensuring both components operate within their respective temperature limits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If one radiator is disposed over both the control semiconductor package and semiconductor memory packages, then the entire module temperature is leveled out, but the semiconductor memory packages are affected by high temperatures of the control semiconductor package resulting in failure to produce effective cooling

Engineering Contradiction:

Improvetemperature uniformity across moduleVSAvoidreliability of semiconductor memory packages

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The single radiator is divided into two separate radiators: a control semiconductor radiator for the control semiconductor package and a semiconductor memory radiator for the semiconductor memory packages. These radiators are disposed without being thermally connected to each other in the direction in which the semiconductor memory packages are arranged, preventing heat transfer from the control package to the memory packages while maintaining temperature control for both components.

Inventive Principle:

Principle #1Segmentation

2Device complexity

If a single radiator is used to cool both control semiconductor package and semiconductor memory packages, then device complexity is reduced, but the semiconductor memory packages cannot be effectively cooled due to thermal interference from the control semiconductor package

Engineering Contradiction:

Improvenumber of radiatorsVSAvoidcooling effectiveness of semiconductor memory packages

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The cooling system is segmented into separate radiators for different functional components. The control semiconductor radiator and semiconductor memory radiator are positioned independently without thermal connection in the arrangement direction, allowing each radiator to optimize cooling for its specific component without interference from other heat-generating elements.

Inventive Principle:

Principle #1Segmentation

3Area of stationary object

If the control semiconductor package with higher heatproof temperature is placed in the central region, then space utilization is improved, but the semiconductor memory packages near the control semiconductor package experience temperature rise affecting their reliability

Engineering Contradiction:

Improvespace utilization of module boardVSAvoidtemperature rise in semiconductor memory packages

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The thermal management system is segmented into separate radiators positioned for each component type. The semiconductor memory radiator is configured to cool memory packages without being thermally connected to the control semiconductor radiator, thereby isolating the memory packages from the high-temperature environment of the control package while maintaining compact central region placement.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A non-thermally connected gap or insulating structure acts as an intermediary between the control semiconductor radiator and semiconductor memory radiator, preventing thermal conduction from the high-heat control package to the temperature-sensitive memory packages while allowing both radiators to function in close proximity for efficient space utilization.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively maintains semiconductor memory packages and control semiconductor packages at appropriate temperatures, enhancing the reliability of the memory module by reducing temperature rise and ensuring efficient cooling without thermal interference.

Implementation Method 1

a control semiconductor radiator thermally connected to the control semiconductor package, and a semiconductor memory radiator thermally connected to the plurality of semiconductor memory packages

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

radiation fins on the control semiconductor radiator for efficient heat dissipation

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS7477520B2Memory module

Publication Date: 2009.01.13 MICRON TECHNOLOGY INC

AI summary

In a memory module, a plurality of semiconductor memory packages are arranged and mounted on a module board, and a control semiconductor package is disposed in a central region of the arrangement of the semiconductor memory packages, and mounted on the module board. A control semiconductor radiator thermally connected to the control semiconductor package, and a semiconductor memory radiator thermally connected to the plurality of memory packages are disposed without being thermally connected to each other in relation to a direction in which the semiconductor memory packages are arranged.