Memory Module Side Conductive Strips for Lower-Package Z-Height
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Solution Overview
Problem
Existing DRAM module packages require multiple power and ground paths through the substrate, leading to increased substrate layer count and Z-height, which hinders the reduction of package size in mobile electronic devices.
Innovation Solution
Incorporating electrically conductive strips, such as metal rings or copper tape, surrounding the DRAM modules to route power and ground directly to multiple BGA contacts without needing additional substrate layers, thereby reducing the number of substrate layers required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple power and ground paths through the substrate are used to supply power to BGA contacts, then reliable power delivery is achieved, but substrate layer count and Z-height increase
Solution Approach 1:
The patent transitions power and ground routing from a planar path through substrate layers to a three-dimensional path using vertical conductive strips on the package sides. These strips extend from the substrate surface to the BGA contacts, providing power delivery in the vertical dimension rather than requiring additional horizontal substrate layers, thereby reducing Z-height while maintaining reliability
Solution Approach 2:
The patent introduces electrically conductive strips as intermediary elements between the substrate and BGA contacts. These strips serve as mediators that carry power and ground signals, replacing the need for multiple substrate layers and reducing the overall package height while ensuring reliable electrical connection
2Adaptability or versatility
If multiple substrate layers are added to route power and ground to multiple BGA contacts, then power distribution capability is improved, but device complexity increases
Solution Approach 1:
The patent segments the power and ground routing function into separate vertical conductive strips located on the package sides, rather than integrating multiple power and ground planes within the substrate. This segmentation allows each strip to independently serve specific BGA contacts, improving power distribution capability while reducing substrate layer complexity
Solution Approach 2:
The patent moves power distribution from a two-dimensional substrate plane to a three-dimensional structure by placing conductive strips on the vertical sides of the package. This dimensional change enables multiple power and ground paths without increasing substrate layer count, as the routing occurs in the vertical space outside the substrate layers
3Length of stationary object
If substrate Z-height is reduced by removing layers, then package size is minimized, but power and ground routing capability is compromised
Solution Approach 1:
The patent introduces electrically conductive strips as intermediary elements that bridge the substrate and BGA contacts. These strips provide the necessary power and ground routing capability that would otherwise require additional substrate layers, enabling Z-height reduction while maintaining full power distribution functionality
Solution Approach 2:
The patent extracts the power and ground routing function from the substrate layers and places it in separate conductive strips on the package sides. This extraction allows the substrate to be simplified with fewer layers while the routing capability is preserved in the external conductive elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a thinner package substrate with reduced Z-height and addresses global substrate capacity issues, allowing for closer integration of memory modules to the die, enhancing memory performance and reducing package size.
Implementation Method 1
an electrically conductive strip on a side of the memory module and at least partially surrounding the memory module, the electrically conductive strip between the top and the bottom, wherein the electrically conductive strip is associated with a power or a ground of the memory module
Data Source
AI summary
Embodiments herein relate to systems, apparatuses, or processes for creating packages that include one or more memory modules with electrically conductive strips on the side of the memory module to route power or provide a ground to multiple BGA contacts on a side of the memory module coupled with a substrate. Providing power and/or ground in this manner enables fewer layers to be used in a substrate that are no longer needed to be routed in the power plane on the substrate, thus reducing a Z-height of the package. Other embodiments may be described and/or claimed.