Memory Module Split-Substrate Layout for Reduced Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing memory systems face challenges in reducing their overall thickness when mounted on a mother substrate, as they are constrained by standard thickness requirements, limiting the available mounting space.
Innovation Solution
The memory system employs a flexible substrate to connect two rigid substrates of different thicknesses, where the thinner first rigid substrate carries the nonvolatile memory and controller, and the thicker second rigid substrate has the connector, allowing for a reduced overall thickness while maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the memory system uses a single rigid substrate with standard thickness, then it meets the standard thickness requirement, but the overall thickness when mounted on mother substrate cannot be reduced
Solution Approach 1:
The memory system divides the substrate into two separate rigid substrates: a first rigid substrate for mounting the nonvolatile memory and controller, and a second rigid substrate for mounting the connector. This segmentation allows each substrate to be optimized independently in thickness while maintaining overall structural integrity and meeting standard requirements.
Solution Approach 2:
The patent introduces a flexible substrate to connect the two rigid substrates, adding a new dimensional aspect to the structure. This flexible connection layer enables thickness optimization in the vertical dimension while maintaining horizontal connectivity and electrical connections between components.
2Length of moving object
If the first rigid substrate is made thinner to reduce overall thickness, then mounting space is increased, but electrical connectivity and structural strength may be compromised
Solution Approach 1:
The flexible substrate acts as an intermediary element between the two rigid substrates, providing both mechanical support and electrical connectivity. This intermediary layer ensures that even when the first rigid substrate is made thinner, reliable electrical connections are maintained through the flexible substrate's conductive traces and connection structure.
3Length of moving object
If the first rigid substrate is made thinner to reduce overall thickness, then mounting space is increased, but structural strength may be compromised
Solution Approach 1:
The memory system employs a composite structure combining two rigid substrates of different thicknesses with a flexible substrate. This composite construction allows the first rigid substrate to be optimized for thinness while the second rigid substrate provides additional structural strength, and the flexible substrate provides mechanical coupling between them.
Data Source
AI summary
A memory system includes a nonvolatile memory, a controller configured to control the nonvolatile memory, a connector that is capable of electrically connecting the controller and a host, a first rigid substrate on which the nonvolatile memory and the controller are mounted, a second rigid substrate on which the connector is mounted, and a flexible substrate that is flexible and electrically connects the first rigid substrate and the second rigid substrate, wherein a thickness of the first rigid substrate is less than a thickness of the second rigid substrate.