Memory Module Guide and Spring Retention for Tool-Less DDIMM Insertion
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Solution Overview
Problem
Computing systems face challenges in guiding and retaining differential DIMM (DDIMM) memory modules due to their small size and high density, lacking the latch features of traditional DIMMs, which leads to connector damage and wear, and previous solutions are either costly or require tools that are inconvenient to use.
Innovation Solution
A guidance and retention structure comprising a guide portion with slots for alignment and a cap portion with spring members that apply a compressive force to the memory modules, allowing for tool-less installation and removal, while minimizing board space and maintaining airflow for cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional DIMM latch features are used for DDIMM retention, then connector retention is improved, but device complexity and board space increase
Solution Approach 1:
The patent extracts the retention function from the traditional complex latch mechanism and implements it through a simplified spring member system. The spring member provides the necessary retention force through elastic deformation rather than mechanical latching, thereby maintaining connector retention while reducing device complexity
Solution Approach 2:
The patent changes the physical state and properties of the retention mechanism by using spring members with specific elastic properties. The spring constant and deflection characteristics are optimized to provide adequate retention force for DDIMM connectors without requiring complex mechanical structures
2Reliability
If additional retention parts are added to DDIMM, then connector retention is improved, but board space and component density are reduced
Solution Approach 1:
The spring members are nested within the guide structure, utilizing the existing vertical space above the DDIMM module. The cap portion houses the spring members, allowing them to be contained within the overall connector assembly footprint rather than requiring additional lateral board space
Solution Approach 2:
The patent transitions from lateral retention mechanisms (traditional latches) to vertical retention using spring members that operate in the vertical dimension. This allows the retention function to be achieved without increasing the lateral footprint on the motherboard
3Manufacturing precision
If tool-based insertion methods are used for DDIMM, then insertion precision is improved, but ease of operation is reduced
Solution Approach 1:
The guide structure with alignment slots and the spring member system are designed to automatically guide the DDIMM module into proper alignment during insertion. The spring members provide tactile feedback and automatic engagement, eliminating the need for external tools while maintaining insertion precision through self-alignment mechanisms
4Productivity
If compact DDIMM form factor is used, then productivity is improved, but connector damage risk increases
Solution Approach 1:
The spring members are pre-loaded to provide cushioning force that absorbs insertion shocks and prevents excessive contact pressure on the DDIMM connectors. This beforehand cushioning protects the delicate connectors from damage while enabling the compact form factor
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a low-cost, tool-less mechanism for securely retaining memory modules of varying heights, ensuring easy access and structural robustness against shock and vibration, while maintaining airflow and visibility of identification features.
Implementation Method 1
a first spring member configured to apply a first compressive force to the first integrated circuit board
Data Source
AI summary
An apparatus for guidance and retention of integrated circuit boards includes a first structure configured to receive a first integrated circuit board and guide the first integrated circuit board for coupling to a substrate. The apparatus further includes a second structure configured to be removably coupled to the first structure. The second structure includes a first spring member configured to apply a first compressive force to the first integrated circuit board.