Memory Module Thermal Control via Dynamic Allocation

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Solution Overview

Problem

Traditional thermal management techniques in information handling systems often result in performance throttling, which is undesirable and does not effectively address rising memory module temperatures without impacting system performance.

Innovation Solution

A system and method that detect thermal alerts in memory modules, modify memory allocation information to reduce the preference for 'distant' memory, and simulate a 'hot eject' of memory modules when temperatures exceed certain thresholds, allowing for thermal recovery without significant performance impact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional thermal management techniques (performance throttling) are used to manage memory module temperatures, then thermal control is achieved, but system performance deteriorates

Engineering Contradiction:
Improvememory module temperatureVSAvoidsystem performance
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent applies local quality by differentiating between different memory modules based on their thermal states. The system identifies specific memory modules that are overheating and applies selective memory allocation modifications only to those modules, rather than applying global performance throttling to the entire system. This allows thermal management of specific components without degrading overall system performance.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the parameter of memory allocation information to control thermal behavior. By modifying memory allocation information to reduce preference for distant memory, the system dynamically adjusts memory access patterns to favor closer memory modules, thereby reducing heat generation at specific locations without reducing overall computational performance.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If memory allocation information is modified to reduce preference for distant memory, then thermal recovery of overheated modules is enabled, but memory allocation complexity increases

Engineering Contradiction:
Improvememory module temperatureVSAvoidmemory allocation complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The system performs preliminary identification of overheated memory modules using thermal sensors before implementing memory allocation modifications. This preliminary detection allows the system to proactively manage thermal issues and can restore normal memory allocation patterns once temperature thresholds are met, avoiding the need for complex continuous monitoring and adjustment mechanisms.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS7797506B2Thermal control of memory modules using proximity information
Publication Date: 2010.09.14 DELL PROD LP
  • US7797506B2 patent drawing
  • US7797506B2 patent drawing
  • US7797506B2 patent drawing

AI summary

An information handling system includes a processor having access to a system memory. The system is operable to detect a thermal alert and identify an associated portion of system memory. The system may then modify memory allocation information used by an operating system to allocate system memory. When the thermal alert indicates a rising memory module temperature that exceeds a specified threshold, the modification of the memory allocation information causes the memory to appear to be more “distant” from the system processor(s) and thereby allocated less preferentially than other memory. If the temperature continues to rise beyond a higher threshold, a second modification of the memory allocation information is performed to simulate a “hot eject” of the memory module. As the memory module cools, the memory allocation information can be restored to simulate a hot add of the memory module and to restore the proximity of the memory module.