Crashworthy Memory Module Thermal Cutoff for Fire Protection

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Solution Overview

Problem

Existing crashworthy memory modules for locomotives are inadequate in preventing heat from fires from being conducted to electronic components through electrical wires, as they require an applied voltage for thermal control and may not effectively disconnect heat from external fires.

Innovation Solution

A thermal wiring disconnect system with thermal cutoffs is integrated into the memory module, where the cutoffs are positioned in slots within the enclosure and attached to wires, disconnecting them from electronic components when a threshold temperature is reached to prevent heat conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If active thermoelectric control systems are used to manage hard drive temperature, then temperature control capability is improved, but system complexity and dependency on external power increase

Engineering Contradiction:
Improvehard drive temperature controlVSAvoidthermal control system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent extracts the thermal management function from complex active control systems and implements it through simple passive thermal cutoff elements that automatically disconnect wires at predetermined temperature thresholds, eliminating the need for powered control mechanisms while maintaining effective temperature management

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The thermal cutoff elements operate autonomously based on temperature conditions, automatically disconnecting wires when threshold temperatures are reached without requiring external control signals or power sources, thereby simplifying the overall system architecture

Inventive Principle:
Principle #25Self-service

2Object-affected harmful factors

If thermal insulation is increased to protect electronic components from fire heat, then heat protection capability is improved, but heat dissipation capability deteriorates

Engineering Contradiction:
Improvefire heat protectionVSAvoidheat dissipation
Core Design Contradiction:
Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent implements dynamic thermal management through cutoff elements that automatically adjust the thermal connection state based on temperature conditions - maintaining thermal connection during normal operation for heat dissipation, and automatically disconnecting when threshold temperatures are reached to prevent fire heat damage

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes the thermal conduction parameter dynamically by transitioning from a conductive state during normal operation to a non-conductive state when temperature thresholds are exceeded, allowing the same structure to provide both heat dissipation and fire protection

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermal wiring disconnect system effectively prevents heat from external fires from damaging electronic components by disconnecting wires at a predetermined temperature, ensuring data integrity and component safety during high-temperature events.

Implementation Method 1

The thermal cutoff may be configured to disconnect the wire from the device when subjected to a threshold temperature

Methodology Applied
Scientific EffectThermal cutoff: Melting

Data Source

PatentUS9484164B2Crashworthy memory module having a thermal cutoff
Publication Date: 2016.11.01 PROGRESS RAIL SERVICES CORP
  • US9484164B2 patent drawing
  • US9484164B2 patent drawing
  • US9484164B2 patent drawing

AI summary

A memory module is disclosed. The memory module may have an enclosure having a slot in a wall of the enclosure. The memory module may also have a device disposed within the enclosure. The memory module may further have a thermal cutoff disposed in the slot. The thermal cutoff may have a first end attached to the device. The thermal cutoff may also have a second end attached to a wire configured to electrically connect to the device. The thermal cutoff may disconnect the wire from the device when subjected to a threshold temperature.