Memory Module Thermocouple Integration for Temperature Monitoring
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Solution Overview
Problem
Existing memory modules lack effective temperature measurement capabilities, particularly for temperature-sensitive DRAMs, which is crucial for system reliability.
Innovation Solution
A memory module with a thermocouple coupled to contact points on a module substrate, integrated with a temperature sensor that generates temperature information, allowing for accurate temperature measurement of memory devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If temperature measurement capability is added to memory module, then system reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines the temperature sensing function with the existing contact points on the module substrate. The thermocouple is integrated into the contact points structure, allowing temperature measurement without adding separate independent components. This merging approach enables temperature monitoring capability while minimizing the increase in device complexity by utilizing existing structural elements.
Solution Approach 2:
The contact points on the module substrate are given dual functionality: they serve both as electrical connection points for memory devices and as temperature sensing elements through the integrated thermocouple. This multi-functionality allows the same structural element to perform multiple roles, thereby improving system reliability through temperature monitoring without proportionally increasing device complexity.
2Measurement precision
If thermocouple is integrated into contact points, then temperature measurement precision is improved, but manufacturing complexity increases
Solution Approach 1:
The thermocouple is integrated directly into the contact points during the manufacturing process, combining two functional elements into a single unified structure. This integration allows temperature measurement at the exact location of electrical contact, improving measurement precision while reducing the number of separate manufacturing steps and component assembly operations.
Solution Approach 2:
The thermocouple is prepared and positioned within the contact points structure before the memory devices are mounted on the module substrate. This preliminary integration ensures that the temperature sensing elements are already in place and properly configured, simplifying the overall manufacturing process by eliminating subsequent assembly steps and ensuring precise thermal coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable temperature monitoring of memory devices, enhancing the system's reliability by providing precise temperature data to external devices.
Implementation Method 1
a thermocouple coupled to at least one contact point among the plurality of contact points
Data Source
AI summary
A memory module may be provided. The memory module may include a thermocouple and a temperature sensor. The thermocouple may be coupled to at least one contact point among a plurality of contact points formed on a region, on which a memory device may be configured to be mounted. The temperature sensor may be coupled to the thermocouple, and may be configured to generate temperature information.