Crashworthy Memory Module Thermal Wiring Disconnect System
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Solution Overview
Problem
Existing crashworthy memory modules for locomotives face challenges in withstanding high temperatures during accidents, as heat from fires can still be conducted through electrical wires, potentially damaging the electronic components, and existing thermal control systems may not function after an accident or prevent heat from entering through these wires.
Innovation Solution
A thermal wiring disconnect system is implemented within the memory module, featuring a filler that expands and ejects through an orifice to push a stopper away from the enclosure's surface, disconnecting the wires from the device when a threshold temperature is reached, thereby preventing heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the memory module is heavily insulated to withstand high temperatures, then the temperature resistance is improved, but heat can still be conducted through electrical wires connecting to external subsystems
Solution Approach 1:
The patent extracts the harmful heat conduction path by physically disconnecting the wire from the device when temperature exceeds the threshold. The wire is removed from the thermal environment by disconnecting it at the stopper location, eliminating the heat conduction pathway while maintaining the insulated enclosure structure.
Solution Approach 2:
The patent introduces a thermal disconnect mechanism as an intermediary between the wire and the device. This mechanism includes a stopper positioned at the wire exit point and a thermal element that activates to push the stopper, thereby mediating the thermal protection by controlling the wire's connection state based on temperature conditions.
2Temperature
If an active thermoelectric controller is used to draw heat away from the device, then the temperature control is improved, but the system requires an applied voltage that may not function after an accident
Solution Approach 1:
The patent implements preliminary action by pre-positioning the stopper at the wire exit point and pre-configuring the thermal element to automatically activate when temperature exceeds the threshold. This passive thermal response mechanism is prepared in advance and does not require external power or control systems to function during or after an accident.
Solution Approach 2:
The patent employs self-service by designing a thermal disconnect system that automatically responds to temperature conditions without requiring external control. The thermal element directly senses the temperature and mechanically actuates the stopper to disconnect the wire, making the system self-regulating and independent of external power sources.
3Loss of information
If the wire remains connected to the device during fire, then data communication is maintained, but heat from the fire conducts through the wire to damage electronic components
Solution Approach 1:
The patent applies preliminary anti-action by pre-positioning the stopper and thermal disconnect mechanism to counteract the harmful heat conduction before it can damage the electronic components. When temperature reaches the threshold, the mechanism automatically acts to prevent further heat transfer, thereby protecting the device from thermal damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively disconnects wires from the memory module's components at high temperatures, safeguarding the data storage devices from heat damage without requiring an external power source, ensuring the integrity of the recorded data during accidents involving fires.
Implementation Method 1
The filler may be configured to expand and be ejected out of the orifice when subjected to a threshold temperature
Data Source
AI summary
A memory module is disclosed. The memory module may have an enclosure and a device disposed within the enclosure. The memory module may also have an orifice in a wall of the enclosure and a wire passing through the orifice. One end of the wire may be attached to the device. The memory module may further have a stopper attached to the wire. The stopper may be located abutting an outer surface of the enclosure. The memory module may also have a filler disposed within the enclosure. The filler may be configured to expand and be ejected out of the orifice when subjected to a threshold temperature. The filler may also be configured to push the stopper away from the outer surface and disconnect the wire from the device.