Memory Modules in Liquid Coolant Chamber
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Solution Overview
Problem
Existing memory module cooling methods, such as using memory module coolers, often result in inefficient heat transfer due to smaller contact areas and additional thermal interfaces, which can lead to increased costs and complexity in installation and maintenance, especially in large-scale computer systems.
Innovation Solution
Integrating memory modules and liquid cooling elements within a packaged device, where the memory modules are submerged in a liquid coolant chamber, allowing for direct and extensive contact with the coolant, thereby increasing heat transfer efficiency and reducing the number of thermal interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If memory module coolers with interface elements are used to cool memory modules, then heat removal function is provided, but heat transfer efficiency is reduced due to smaller contact areas and additional thermal interfaces
Solution Approach 1:
The patent combines the memory module and cooling elements into a single integrated package. The memory modules are disposed within a liquid coolant chamber where they directly contact the coolant, eliminating separate cooler components and multiple thermal interfaces. This merging of functions achieves superior heat transfer efficiency while reducing device complexity.
2Temperature
If memory module coolers are attached to memory modules, then cooling function is achieved, but installation and maintenance complexity increases
Solution Approach 1:
By integrating the cooling function directly into the memory module package, the patent eliminates the need for separate cooler attachment and simplifies maintenance. The memory modules are factory-sealed within the liquid coolant chamber, requiring no field installation of cooling components and enabling straightforward replacement of entire modules rather than separate cooler assembly.
Solution Approach 2:
The cooling system is pre-configured and sealed during manufacturing with the memory modules already positioned within the liquid coolant chamber. This preliminary arrangement of cooling elements eliminates the need for complex field installation and ensures optimal thermal contact from the outset.
3Loss of energy
If traditional memory module coolers are used, then heat removal is provided, but costs increase due to additional components and interfaces
Solution Approach 1:
The integration of memory modules and cooling elements into a single package reduces the total component count and eliminates the need for separate cooler assemblies, thermal interfaces, and associated mounting hardware. This consolidation lowers manufacturing costs while maintaining effective heat removal capability through direct liquid coolant contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat transfer rates by maximizing the contact area between the memory modules and the coolant, simplifies installation, and reduces costs and complexity compared to traditional methods, while maintaining standard server and rack designs.
Implementation Method 1
the liquid coolant surrounds and directly contacts the memory modules... transfer the heat (directly, or through intermediaries) to a heat removing medium, such as air or liquid coolant
Data Source
AI summary
An example memory device includes a printed circuit board, a case, a bus, and memory modules. The case includes a number of walls, and at least some of the walls and the printed circuit board together form a liquid coolant chamber that is liquid-tight (excluding any hose connectors). The bus includes memory sockets connected to the printed circuit board and located within the liquid coolant chamber, and the memory modules are installed in the memory sockets and within the liquid coolant chamber. The bus also includes a connector to connect to a memory bus of a main printed circuit board of a computing device, the connector being external to the liquid coolant chamber.