Memory Package Active Cooling for High-Density Heat Dissipation
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Solution Overview
Problem
High-performance computer processing systems face challenges in managing heat generated by high-speed memory circuits, which can lead to reduced memory retention and increased power consumption due to inadequate cooling methods.
Innovation Solution
The integration of active cooling devices within memory packages, where at least one memory chip is disposed on a substrate and the active cooling device is positioned between the memory chips and a package surface to actively conduct heat away from the memory chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If passive cooling methods (heat sinks, fans) are used on external component surfaces, then heat dissipation is improved, but memory chips still experience high temperatures that reduce retention and increase power consumption
Solution Approach 1:
The patent combines the cooling device with the memory package by integrating a thermally conductive member between the memory chip and the package substrate. This merging allows the cooling function to be built into the package structure itself, enabling direct heat extraction from the memory chip through the substrate to the external environment, thereby improving temperature control and memory reliability.
2Productivity
If more memory chips are packed into a smaller volume, then system integration is improved, but heat generation increases causing overheating and potential damage
Solution Approach 1:
The patent introduces a thermally conductive member as an intermediary between the memory chip and the package substrate. This intermediary component facilitates efficient heat transfer from the memory chip through the substrate to the external environment, enabling high-density memory packaging while managing the harmful thermal effects through the mediating thermal conduction path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from memory chips, preventing overheating and potential damage, while also reducing power consumption and memory access times, thus enhancing the reliability and performance of computer processing systems.
Implementation Method 1
an active cooling device disposed between the memory chips and a package surface to actively conduct heat from the memory chips to the package surface
Data Source
AI summary
Memory packages are employed in computer processing systems to house memory chips that store data for a processing circuit. The memory chips consume power each time they are accessed, which may be thousands of times per second, which generates heat that needs to be dissipated to avoid high temperatures that may damage memory circuits in the memory chips. The memory packages may include at least one memory chip disposed on a substrate. The memory packages may also include an active cooling device disposed between the memory chips and a package surface to actively conduct heat from the memory chips to the package surface, where it may be dissipated. The active cooling device May be on an opposite side of the memory chips from the substrate or may be disposed in a cavity in the substrate.