Semiconductor Memory Package Layout for High-Bandwidth Low-Power Processing

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Solution Overview

Problem

The increasing demand for faster data transmission between computing units and semiconductor memory is hindered by power constraints in shrinking processing units, limiting off-chip bandwidth development.

Innovation Solution

A semiconductor memory system is developed, featuring a data storage device, a data processing device, and a contact element that electrically connects them, allowing for higher processing bandwidth without sacrificing low-power performance by enabling command, address, and data signal processing and transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If processing units are shrunk to increase computing power, then processing speed and capability are improved, but power consumption increases and off-chip bandwidth requirements increase

Engineering Contradiction:

Improveprocessing powerVSAvoidpower consumption

Core Design Contradiction:

PowerVSUse of energy by moving object

Solution Approach 1:

The patent combines the data processing device with the data storage device into a single semiconductor memory package, allowing them to function as an integrated system. The data processing device is positioned adjacent to the data storage device and communicates through contact elements, merging storage and processing functions while reducing power consumption compared to separate off-chip operations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces contact elements as intermediary components that electrically connect the data storage device and data processing device. These contact elements facilitate low-power communication between the two devices within the package, serving as a mediator that reduces the need for high-power off-chip data transmission.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If data processing is performed off-chip to increase bandwidth, then data transmission capability is improved, but power consumption and system complexity increase

Engineering Contradiction:

Improveoff-chip bandwidthVSAvoidpower consumption

Core Design Contradiction:

ProductivityVSUse of energy by moving object

Solution Approach 1:

The patent transitions from traditional off-chip processing to an integrated within-package architecture. By positioning the data processing device within the same package as the data storage device and using vertical contact elements for connection, the system achieves high bandwidth through a different spatial dimension (within-package integration) rather than relying on external off-chip connections.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Productivity

If a data processing device is added to increase bandwidth, then data transmission capability is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

ImprovebandwidthVSAvoidsystem complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The data processing device within the package serves multiple functions: it processes data from the data storage device, performs computations, and communicates results back. This multi-functional integration increases bandwidth while managing complexity by consolidating functions within a single package rather than requiring separate external components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20230284438A1Method for manufacturing a semiconductor memory

Publication Date: 2023.09.07 NAN YA TECH

AI summary

A method of manufacturing a semiconductor memory is provided. The method includes steps of forming a data storage device; forming a data processing device over the data storage device; forming a contact element electrically connected to the data storage device; and forming a data processing device over the data storage device and electrically connected to the contact element.