Memory Package Encapsulation Thickness Normalization
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Solution Overview
Problem
Current wafer-level packaging technologies face challenges in efficiently encapsulating memory components with varying thicknesses and configurations, leading to increased manufacturing costs and complexity due to the need for precise thickness matching and sorting of memory components before packaging.
Innovation Solution
A method involving the use of a first insulating encapsulation that normalizes the thickness of memory components with different vertical thicknesses through planarization, allowing for their common encapsulation in a single package, and a second encapsulation that embeds semiconductor chip structures, enabling efficient packaging without prior sorting and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer-level packaging is used to encapsulate memory components, then manufacturing efficiency is improved, but components with varying thicknesses cannot be efficiently packaged without precise sorting
Solution Approach 1:
The patent applies parameter changes by modifying the encapsulation material to have flowable characteristics that allow it to adapt to different component thicknesses. The encapsulation material's viscosity and flow properties are changed to enable automatic leveling and filling, eliminating the need for precise thickness matching of components before packaging.
Solution Approach 2:
The patent implements local quality by allowing the encapsulation material to have different properties in different regions - it flows and levels in areas with varying component heights, then solidifies to provide uniform protection. This localized adaptation to different thicknesses within the same package resolves the contradiction between handling varied components and maintaining packaging efficiency.
2Device complexity
If memory components with different thicknesses are packaged together, then manufacturing complexity is reduced, but adhesion and delamination risks increase
Solution Approach 1:
The encapsulation material's physical parameters are changed to include flowable and self-leveling properties during the packaging process. This allows the material to conform to different component thicknesses and create uniform adhesion across all components, eliminating delamination risks associated with thickness variations while maintaining packaging simplicity.
Solution Approach 2:
The patent uses composite encapsulation materials that combine flowable properties for adaptation to varying thicknesses with strong adhesion properties for reliable bonding. This composite approach allows the material to simultaneously handle different component heights and provide uniform, reliable adhesion across all components in the package.
Data Source
AI summary
A package includes at least one memory component and an insulating encapsulation. The at least one memory component includes a stacked memory structure and a plurality of conductive posts. The stacked memory structure is laterally encapsulated in a molding compound. The conductive posts are disposed on an upper surface of the stacked memory structure. The upper surface of the stacked memory structure is exposed from the molding compound. The insulating encapsulation encapsulates the at least one memory component. The top surfaces of the conductive posts are exposed form the insulating encapsulation. A material of the molding compound is different a material of the insulating encapsulation.