Memory Die Package Power Coordination for Peak Current Budgeting
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Solution Overview
Problem
Conventional peak power management (PPM) designs for NAND memory die packages in solid state drives (SSDs) fail to efficiently manage peak power consumption across multiple die packages, leading to potential voltage drops and inefficiencies due to overlapping peak energy usage, with existing systems often relying on worst-case scenario tuning that is inefficient and prone to exceeding power budgets.
Innovation Solution
Implementing predictive peak power management (P-PPM) across multiple memory die packages using token ring communication and global PPM logic, where each die communicates current consumption levels to manage peak current usage collectively, preventing overlaps and optimizing power usage through staggered operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple memory die packages are used to achieve high density SSD design, then storage capacity is improved, but peak power consumption exceeds system budget due to overlapping peak energy usage
Solution Approach 1:
The PPM logic in each memory die package proactively monitors and communicates its current power consumption state to other packages before peak power events occur. This preliminary action allows the system to anticipate and coordinate power management, preventing overlapping peak power consumption across multiple packages and ensuring the total power remains within system budget.
Solution Approach 2:
A feedback mechanism is implemented where each memory die package's PPM logic continuously reports its current power consumption state to a global PPM logic. The global PPM logic aggregates this feedback from all packages and coordinates power management decisions, enabling dynamic adjustment of power usage across the system to prevent exceeding the power budget.
2Ease of operation
If conventional PPM designs manage power within individual memory die packages, then local power control is achieved, but global power budget is exceeded due to lack of coordination between packages
Solution Approach 1:
The invention merges local PPM logic in each memory die package with a global PPM logic that coordinates across all packages. The local PPM logic maintains ease of operation for individual packages, while the global PPM logic combines information from all packages to ensure overall power budget compliance, achieving both local control and global coordination.
Solution Approach 2:
The global PPM logic acts as an intermediary between the local PPM logics of different memory die packages. It receives power state information from local logics, processes this information centrally, and coordinates power management decisions that ensure global power budget compliance while allowing local packages to maintain their operational independence.
3Reliability
If worst-case scenario tuning is used for PPM performance, then reliability is improved, but efficiency deteriorates due to overly conservative power management
Solution Approach 1:
The PPM system transitions from static worst-case tuning to dynamic power management. The PPM logic in each package continuously monitors actual power consumption and communicates real-time status to the global PPM logic, which dynamically adjusts power allocation based on actual conditions rather than conservative worst-case assumptions, improving efficiency while maintaining reliability.
Solution Approach 2:
The system changes the parameter of power management from fixed worst-case values to dynamic values based on actual power consumption states. By monitoring and adjusting power parameters in real-time based on actual usage patterns rather than predetermined worst-case scenarios, the system achieves better efficiency while maintaining the reliability needed to prevent power budget violations.
Data Source
AI summary
A variety of applications can include multiple memory die packages configured to engage in peak power management (PPM) across the multiple packages of memory dies. A communication line coupled to each memory die in the multiple memory die packages can be used to facilitate the PPM. A global management die can start a communication sequence among the multiple memory die packages to share a current budget across the multiple memory die packages by driving a signal on the communication line. Local management dies can use the received signal having clock pulses driven by the global management die on the communication line to engage in the PPM. To engage in global PPM, each memory die can be structured, to be selected as the global management die or a local management die, with one or more controllers to interface with the multiple memory die packages and to handle current budget limits.