Memory Module PCB Solder Joint Layout for Higher Chip Density
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Solution Overview
Problem
Conventional dual-inline memory modules face challenges in achieving high-density small space requirements due to the large area combination of gold fingers and insertion slots, which limits the number of memory chips that can be mounted in a given space.
Innovation Solution
The memory module utilizes a solder joint array on a module PCB to establish communication connections without gold fingers or insertion slots, allowing for a smaller connection region and enabling more memory chips to be mounted on a module PCB of the same area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gold finger and insertion slot combination is used for connection, then communication connection between memory module and substrate is established, but connection region area becomes large
Solution Approach 1:
The patent extracts and removes the gold finger and insertion slot components from the memory module connection structure. Instead of using these traditional mechanical connection elements, the patent directly mounts the memory chip to the PCB board through solder joints, eliminating the need for separate gold fingers and insertion slots. This extraction principle directly reduces the connection region area while maintaining communication connection functionality.
Solution Approach 2:
The patent merges the connection function into the PCB board itself by integrating the solder joint array directly onto the board. The connection region is combined with the PCB mounting structure, eliminating the need for separate gold finger components and insertion slot structures. This merging approach reduces overall connection region area while establishing reliable communication connections between the memory chip and substrate.
2Reliability
If conventional DIMM structure with gold finger is used, then communication connection is established, but area occupied is large limiting memory chip density
Solution Approach 1:
The patent extracts the gold finger component from the traditional DIMM structure, replacing it with direct solder joint mounting of memory chips to the PCB board. This removal of the gold finger structure reduces the area occupied by the connection region, thereby increasing the available space for mounting memory chips and improving memory chip density on the same PCB board area.
Solution Approach 2:
The patent transitions from a mechanical insertion connection (gold finger in insertion slot) to a planar solder joint connection on the PCB surface. This dimensional change from three-dimensional mechanical engagement to two-dimensional surface mounting reduces the vertical and lateral space requirements, enabling higher memory chip density while maintaining reliable communication connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the size of the connection region, facilitating higher density and flexibility in memory chip placement, while also simplifying assembly and maintenance processes.
Implementation Method 1
a communication connection to a target circuit board is implemented through a solder joint array in a connection region on the module PCB
Data Source
AI summary
A memory module and an electronic device, to meet the requirements of a high-density small space. The memory module pro includes a first assembly having a first module PCB and at least one first memory chip. The first module PCB includes a first memory region and a first connection region including a first solder joint array. The first memory region is configured to mount the at least one first memory chip, and the first solder joint array is configured to connect the first module PCB with a target circuit board, and to establish a communication connection between the first module PCB and the target circuit board.