Memory Device Segmentation for Parasitic Isolation
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Solution Overview
Problem
Current memory devices face challenges in enhancing reliability during reading operations due to issues with voltage application and parasitic transistor activation, leading to incorrect data retrieval and electrical connections between strings.
Innovation Solution
The memory device employs a shared pillar structure with specific voltage applications to isolate and connect strings, using a sequence of voltages to ensure accurate data reading by controlling the states of selection gate transistors and word lines, thereby preventing incorrect current paths and ensuring reliable data retrieval.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If voltage is applied to read data from memory strings, then data retrieval is enabled, but parasitic transistors may activate causing incorrect current paths and unreliable reading
Solution Approach 1:
The memory device is divided into multiple independently controllable blocks, each with its own selection gate transistors. By segmenting the memory into blocks and applying voltage selectively to specific blocks, the patent prevents parasitic transistor activation in non-selected blocks while enabling reliable reading in the selected block. The selection gate transistors act as isolation switches that segment the current paths between different memory strings.
Solution Approach 2:
Different voltage levels are applied to different regions of the memory device based on their selection state. The selected block receives a first voltage level that enables reading, while non-selected blocks receive a second voltage level that keeps parasitic transistors inactive. This local differentiation of voltage conditions ensures that only the intended memory string conducts current during reading, eliminating interference from parasitic transistors in other regions.
2Quantity of substance
If three-dimensional memory structure is used to increase storage capacity, then memory density is improved, but voltage control complexity and parasitic effects increase
Solution Approach 1:
The three-dimensional memory structure is segmented into multiple blocks along the vertical direction, with each block having independent selection gate control. This segmentation allows the complex 3D structure to be managed as multiple simpler 2D-like layers, reducing voltage control complexity. Each block can be independently activated, simplifying the overall control scheme despite the 3D architecture.
Solution Approach 2:
The patent introduces a vertical dimension to the memory structure by stacking multiple memory blocks along the z-axis. This dimensional expansion increases storage capacity without proportionally increasing voltage control complexity, because the selection gate transistors provide hierarchical control - first selecting a block vertically, then selecting a string within the block. The shared pillar structure further simplifies control by allowing multiple strings to share common elements.
3Measurement precision
If selection gate transistors are used to isolate memory strings, then reading accuracy is improved, but additional voltage application steps are required
Solution Approach 1:
The selection gate transistors are activated in advance before the actual reading operation begins. By pre-establishing the correct voltage state on the selection gates, the patent ensures that only the intended memory string is conductive before data retrieval starts. This preliminary isolation prevents parasitic current paths from forming during the reading process, improving accuracy without requiring additional corrective steps.
Solution Approach 2:
The patent combines multiple functions into the selection gate transistor structure: it serves as both the isolation switch for preventing parasitic transistor activation and the enable switch for initiating reading. By merging these functions into a single control mechanism, the patent reduces the number of separate voltage application steps needed, thereby reducing time loss while maintaining reading accuracy.
Data Source
AI summary
A memory device includes a semiconductor column extending above a substrate, a first conductive layer on a first side of the semiconductor column, a second conductive layer on a second side of the semiconductor column, opposite to the first conductive layer, a third conductive layer above or below the first conductive layer and on the first side of the semiconductor column, a fourth conductive layer on the second side of the semiconductor column, opposite to the third conductive layer, and a bit line connected to the semiconductor column. During reading in which a positive voltage is applied to the bit line, first, second, third, and fourth voltages applied to the first, second, third, and fourth conductive layers, respectively, wherein the first voltage and the third voltage are higher than each of the second voltage and the fourth voltage, and the third voltage is higher than the first voltage.


