Memory Self-Test Circuitry for Accurate Post-Repair Defect Location

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Solution Overview

Problem

Self-test circuits in memory devices, such as HBM, face challenges in accurately determining the physical location of defects after repair, leading to incorrect identification of defects during retesting, as the correspondence between logical and physical addresses is not maintained post-repair.

Innovation Solution

Incorporating circuitry within the self-test circuit that adjusts the correspondence between logical and physical addresses to match the pre-repair mapping, utilizing unused data paths from redundant memory locations to provide repair information and restore the original mapping, allowing accurate defect location identification.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If repair is performed on memory devices, then defective column planes are corrected, but the correspondence between logical and physical addresses changes, causing incorrect defect location identification during retesting

Engineering Contradiction:
Improvedefect detection accuracyVSAvoidaddress mapping information
Core Design Contradiction:
ReliabilityVSLoss of information

Solution Approach 1:

The patent applies preliminary action by capturing and storing the pre-repair mapping between logical and physical addresses before the repair process alters the address correspondence. This stored pre-repair mapping is then used during retesting to accurately identify defect locations, preventing the information loss that would otherwise occur due to address mapping changes after repair.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If retesting is performed after repair, then defect detection capability is maintained, but incorrect physical location identification occurs due to altered address mapping

Engineering Contradiction:
Improveretesting efficiencyVSAvoiddefect location precision
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The patent introduces an intermediary mechanism in the form of stored pre-repair mapping information that mediates between the test circuit's logical address requirements and the physical reality after repair. This intermediary mapping allows retesting to proceed efficiently using logical addresses while accurately translating to the correct physical defect locations, thus maintaining both retesting efficiency and measurement precision.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If address mapping is updated after repair, then the memory device operates with correct current mapping, but the test circuit cannot accurately identify original defect locations

Engineering Contradiction:
Improvememory operation correctnessVSAvoidoriginal defect location information
Core Design Contradiction:
Ease of operationVSLoss of information

Solution Approach 1:

The patent captures and preserves the pre-repair address mapping information before any repair operations alter the address correspondence. This preliminary capture of mapping information ensures that even though the memory device operates with updated correct mapping after repair, the original defect location information is retained and can be used for accurate defect identification during retesting.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20240331794A1Apparatuses and methods for testing memory devices
Publication Date: 2024.10.03 MICRON TECHNOLOGY INC
  • US20240331794A1 patent drawing
  • US20240331794A1 patent drawing
  • US20240331794A1 patent drawing

AI summary

Self-test circuits of memory devices disclosed herein may include circuitry that adjusts the correspondence between logical and physical addresses to match pre-repair mapping of memory locations. That is, if a memory device has been repaired by remapping logical addresses to new physical addresses, the circuitry of the test circuit restores the pre-repair mapping of the memory device in some examples. In some examples, an unused global column redundancy data path may be repurposed to provide repair information to the self-test circuit to implement the pre-repair mapping.