Memory Socket Anti-Vibration Heat Dissipation Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Industrial and military computers require effective anti-vibration and heat dissipation structures for small outline dual in-line memory modules (SO-DIMM) sockets, which are often limited by space constraints and need to maintain high reliability and stability in harsh environments, while also facilitating easy maintenance.
Innovation Solution
An anti-vibration and heat dissipation structure comprising a circuit board with stacked memory sockets, heat dissipation pads on the memory modules, a heat dissipation shell with a maintenance window, and a cover board that forms a vertical position-limiting and anti-vibration structure to conduct heat from memory modules to the shell, utilizing thermal conduction devices for efficient heat dissipation and easy module access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If memory modules are installed in stacked configuration to save space, then space utilization is improved, but heat dissipation becomes more difficult due to accumulated heat
Solution Approach 1:
The patent transitions from horizontal to vertical stacking of memory modules, utilizing the third dimension (height) to improve space utilization. Simultaneously, it introduces a heat dissipation shell and cover board structure that extends upward to conduct heat away from the stacked modules, resolving the heat accumulation issue created by vertical stacking.
2Reliability
If the memory socket structure is sealed for protection, then reliability is improved, but maintenance accessibility deteriorates
Solution Approach 1:
The memory socket structure is divided into separate functional components: a protective shell for environmental sealing and a cover board with maintenance windows for access. This segmentation allows the structure to simultaneously provide protection through the sealed shell and maintenance accessibility through the window openings in the cover board.
3Object-affected harmful factors
If vibration damping structures are added to protect memory modules, then anti-vibration capability is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into integrated structures: the cover board simultaneously provides structural support, maintains spacing between stacked modules, and incorporates maintenance windows. The heat dissipation shell integrates thermal management with mechanical protection, reducing overall device complexity while achieving anti-vibration capability through the robust enclosed structure.
4Temperature
If heat dissipation components are added to manage thermal load, then temperature control is improved, but device complexity increases
Solution Approach 1:
The cover board serves multiple functions: it provides structural support for the stacked memory modules, maintains proper spacing, incorporates maintenance windows for accessibility, and works with the heat dissipation shell to manage thermal loads. The heat dissipation shell itself provides both thermal management and mechanical protection, reducing the need for separate dedicated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced heat dissipation and anti-vibration capabilities, ensuring high reliability and ease of maintenance for industrial and military computers, effectively addressing the challenges of heat accumulation and vibration in compact systems.
Implementation Method 1
configured to upwardly conduct heat, generated by the plurality of memory modules, to the topmost heat dissipation pad via a stack structure of the plurality of heat dissipation pads and the plurality of memory modules
Implementation Method 2
having a bottom surface abutted with the topmost heat dissipation pad, so as to form a vertical position-limiting and anti-vibration structure to conduct the heat, generated by the plurality of memory modules, to the heat dissipation shell via the cover board for heat dissipation
Data Source
AI summary
An anti-vibration and heat dissipation structure for a memory socket includes a circuit board, a heat dissipation pad, and a heat dissipation shell. The circuit board includes memory sockets for insertions of memory modules. The heat dissipation pads are disposed on upper and lower surfaces of memory modules, respectively, to upwardly conduct heat, generated by the memory modules to the topmost heat dissipation pad via a stack structure of the memory modules and the heat dissipation pads. The heat dissipation shell comprises a maintenance window, and a cover board disposed on the maintenance window and having a bottom surface abutted with the topmost heat dissipation pad, to form a vertical position-limiting and anti-vibration structure to conduct heat to the heat dissipation shell via the cover board for dissipation, and easy maintenance of the memory modules via the maintenance window is also achieved.