Parallel Memory Module Socket Layout for Compact Board Stacking
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Solution Overview
Problem
Conventional memory module and circuit board interfaces often result in a tall form factor, which can be disadvantageous in space-constrained applications, and may not efficiently utilize space in immersion servers where liquid cooling is used, leading to increased costs due to expensive cooling liquids and wasted volume.
Innovation Solution
The proposed solution involves coupling memory modules to circuit boards such that the memory module's surface is in a plane parallel to the circuit board's surface, allowing for a more compact design. This is achieved through sockets with rotated receiver portions and electrically conductive lines that provide both physical and electrical coupling, enabling the memory module to extend parallel to the circuit board's plane, thus reducing height and allowing for more efficient stacking and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional memory module interfaces are used, then physical coupling is achieved, but the form factor becomes tall and space is wasted
Solution Approach 1:
The patent rotates the receiver portion of the socket by approximately 90 degrees relative to the circuit board surface, changing the orientation from vertical to horizontal. This dimensional change allows the memory module to extend parallel to the circuit board plane rather than perpendicular to it, transforming the form factor from tall to compact and improving space utilization in the vertical dimension.
2Volume of moving object
If memory modules are stacked vertically, then space efficiency improves, but heat transfer efficiency decreases
Solution Approach 1:
By rotating the interface to allow horizontal extension of memory modules parallel to the circuit board, the patent creates optimal spacing between stacked modules. This orientation change improves thermal convection pathways and allows cooling liquids to flow more effectively between modules, enhancing heat transfer while maintaining high stacking density.
3Volume of moving object
If parallel plane configuration is used, then space efficiency improves, but interface complexity increases
Solution Approach 1:
The patent achieves the parallel plane configuration through a single 90-degree rotation of the socket receiver portion, which is a relatively simple geometric transformation. This rotational approach maintains electrical connection integrity while achieving compact form factor, avoiding the need for complex flexible cables or multi-stage connection mechanisms.
Data Source
AI summary
This disclosure relates generally to interfaces between memory modules and circuit boards. More specifically, this disclosure relates to interfaces for coupling a memory module to a circuit board such that the memory module is arranged in a plane that is substantially parallel with a plane of the circuit board. Various embodiments disclosed herein include interfaces, memory modules including interfaces or portions of interfaces, and/or circuit boards including interfaces and/or portions of interfaces. Associated devices and systems are also disclosed.