Memory Module Socket Interface for Higher DDR Current Capacity
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Solution Overview
Problem
Current memory module connection interfaces, particularly for DDR devices, face insufficient current capacity due to limited power contacts, which may not meet the demands of future large-capacity Dynamic Random Access Memory (DRAM) devices.
Innovation Solution
The proposed solution involves an interface apparatus with an add-in module and socket configuration that includes a card-edge connector and electrical contact fingers, where the socket features a slot channel with an electrical contact pad to provide increased current capacity by reversing the traditional contact configuration, allowing for additional power and ground contacts in the slot channels and on the card-edge connector, thereby supporting higher current needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional contact configuration is used with limited power contacts, then device complexity is reduced, but current capacity becomes insufficient for future large-capacity DRAM devices
Solution Approach 1:
The patent inverts the traditional contact configuration by placing electrical contact fingers on the socket rather than on the memory module. This reversal allows the slot channels to accommodate additional power and ground contacts, significantly increasing current capacity while maintaining a relatively simple overall structure. The inversion enables the socket to actively provide multiple contact points to the module's card-edge connector.
Solution Approach 2:
The patent utilizes the slot channel dimension to add multiple power and ground contacts beyond the traditional single power contact. By expanding contacts in the vertical dimension through the slot channel structure, the design achieves higher current capacity without proportionally increasing horizontal space requirements or overall device complexity.
2Quantity of substance
If additional power and ground contacts are added in slot channels, then current capacity increases, but manufacturing precision requirements increase
Solution Approach 1:
The electrical contact fingers are pre-positioned and affixed to the socket during manufacturing, establishing fixed alignment references before the memory module is installed. This preliminary positioning ensures that when the module is inserted, the card-edge connector contacts align precisely with the pre-established finger contacts, reducing the need for high-precision alignment during final assembly.
Solution Approach 2:
The slot channel structure itself provides the alignment mechanism for the additional contacts. The physical geometry of the slot channels guides the card-edge connector into proper alignment with the electrical contact fingers, allowing the structure to self-align without requiring external alignment fixtures or complex positioning systems.
3Power
If separate power and ground contacts are used in contact arrays, then current delivery is improved, but device complexity and contact count increase
Solution Approach 1:
The patent merges the power and ground contact functions into the slot channel structure rather than using separate contact array elements. Multiple power and ground contacts are integrated within the same slot channel region, combining what would traditionally be separate contact array components into a unified structural solution that delivers higher power capacity without proportionally increasing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures sufficient current capacity for current and future memory devices, enhancing the power delivery to DDR modules and accommodating higher power requirements without the need for separate power and ground contacts in the contact arrays, thus supporting increased memory bandwidth and storage capacity.
Implementation Method 1
an electrical contact finger on a second edge of the add-in module... an electrical contact pad configured such that, when the add-in module is installed into the add-in module socket, a current is provided between the add-in module socket and the add-in module through the electrical contact pad and the electrical contact finger
Data Source
AI summary
An interface apparatus for installing an add-in module to an information handling system includes the add-in module and an add-in module socket. The add-in module includes a card-edge connector on a first edge of the add-in module, and an electrical contact finger on a second edge of the add-in module. The add-in module socket is affixed to the information handling system and receives the add-in module. The add-in module socket includes a card-edge connector interface for receiving the card edge connector, and a slot channel for receiving the second edge of the add-in module. The slot channel includes an electrical contact pad configured such that, when the add-in module is installed into the add-in module socket, a current is provided between the add-in module socket and the add-in module through the electrical contact pad and the electrical contact finger.