Self-Terminating Memory Module Socket for Reflection Reduction
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Solution Overview
Problem
Reflections in memory module sockets remain a significant issue despite advancements in equalization techniques, as they are not fully mitigated by current technologies, affecting the efficiency of information handling systems.
Innovation Solution
A self-terminating memory module socket design that uses resistive coatings and ribs to connect signal pins to ground when a memory module is not coupled, reducing reflections by ensuring proper termination and decoupling mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If equalization approaches like DFE are used at memory controller and memory modules, then the impact of loss is mitigated, but reflections are only mitigated to some extent and remain a significant issue
Solution Approach 1:
The patent applies preliminary action by pre-configuring resistive coatings on contact pins before memory modules are installed. These coatings are positioned in advance to automatically terminate signals to ground when modules are absent, preventing reflections before they can propagate through the memory controller interface.
Solution Approach 2:
The patent introduces resistive coatings as an intermediary element between the contact pins and ground. These coatings act as a mediator that provides controlled impedance termination, absorbing signal energy and preventing direct reflections between open connectors and the memory controller.
2Device complexity
If contact pins are left open when memory modules are decoupled, then device complexity is reduced, but reflections increase significantly
Solution Approach 1:
The patent implements self-service by designing contact pins with integrated resistive coatings that automatically provide termination functionality. When memory modules are decoupled, the contact pins self-terminate to ground through the resistive coatings without requiring external switching mechanisms or additional components, thus maintaining low complexity while eliminating reflections.
3Object-generated harmful factors
If termination to ground is implemented when memory modules are decoupled, then reflections are reduced, but device complexity increases
Solution Approach 1:
The patent merges the termination function directly into the contact pin structure by applying resistive coatings to the pin surfaces. This integration combines the electrical contact function and the termination function into a single component, eliminating the need for separate termination circuits or switching mechanisms and thus avoiding increased device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces reflections in memory module sockets, enhancing the efficiency and reliability of information handling systems by ensuring proper signal termination and decoupling.
Implementation Method 1
a plurality of first resistive coatings connecting two or more of the first contact pins to define first groupings of contact pins
Implementation Method 2
when the first contact pins are in a first position, the second contact points of the first contact pins are in contact with respective first resistive coatings to complete a termination to ground
Data Source
AI summary
A memory module socket, including a first member extending between a first end and a second end of the socket, the second end of the socket opposite to the first end of the socket, the first member positioned along a first side of the socket, the first member including: a plurality of first contact pins, each of the first contact pins including a first contact point and a second contact point; a plurality of first resistive coatings connecting two or more of the first contact pins to define first groupings of contact pins; a plurality of first ribs separating each of the first groupings of first contact pins; wherein when the first contact pins are in a first position, the second contact points of the first contact pins are in contact with respective first resistive coatings to complete a termination to ground.