Memory Structure Spacer Design for Coupling Ratio

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional memory structures face challenges with decreasing coupling ratios due to smaller memory cell sizes, requiring higher voltages for operation, leading to reduced efficiency and reliability, and suffer from parasitic transistor effects and electric leakage.

Innovation Solution

A memory structure design featuring a spacer with a higher top surface than the shallow trench isolation, preventing concave portion formation and electric leakage, while increasing the overlapping area between the floating gate and control gate, thus enhancing the coupling ratio.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the memory cell size is reduced to meet miniaturization requirements, then the physical size of the memory decreases, but the overlapping area of the floating gate and control gate decreases, resulting in lower coupling ratio

Engineering Contradiction:
Improvememory cell sizeVSAvoidcoupling ratio
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent introduces a spacer structure at the sidewall of the shallow trench isolation, creating a vertical dimension extension. This spacer causes the floating gate surface to form a curvature that extends beyond the original isolation boundary, effectively increasing the overlapping area in the vertical dimension while maintaining the same planar footprint, thus resolving the contradiction between miniaturization and coupling ratio maintenance

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If wet etching process is used to remove pad oxide, then the pad oxide is removed from the substrate, but concave portions are formed on the sidewall of shallow trench isolation, causing electric leakage and manufacturing difficulties

Engineering Contradiction:
Improvepad oxide removalVSAvoidelectric leakage
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies a spacer material to the sidewall of the shallow trench isolation before the wet etching process. This spacer acts as a protective layer that prevents the etching solution from attacking the isolation sidewall, thereby preventing concave portion formation and the associated electric leakage problems while still allowing complete pad oxide removal

Inventive Principle:
Principle #9Preliminary anti-action

3Volume of moving object

If higher voltage is applied on the control gate to compensate for low coupling ratio, then the memory can function with smaller cell size, but the efficiency and reliability of the memory decreases

Engineering Contradiction:
Improvememory cell sizeVSAvoidmemory efficiency
Core Design Contradiction:
Volume of moving objectVSProductivity

Solution Approach 1:

By extending the floating gate overlap area into the vertical dimension through the spacer-induced curvature, the patent increases the coupling ratio without reducing the planar cell area. This maintains efficient operation at standard voltages while preserving miniaturization benefits, resolving the contradiction between cell size reduction and efficiency maintenance

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS7535050B2Memory structure with high coupling ratio
Publication Date: 2009.05.19 PROMOS TECH INC
  • US7535050B2 patent drawing
  • US7535050B2 patent drawing
  • US7535050B2 patent drawing

AI summary

A memory structure comprising a plurality of memory cells is described. Each memory cell comprises a substrate, a shallow trench isolation, a spacer, a tunnel oxide, and a floating gate. The shallow trench isolation in the substrate is used to define an active area. The spacer is at the sidewall of the shallow trench isolation and is higher than the shallow trench isolation. The tunnel oxide is on the active area. The floating gate is on the tunnel oxide.