Memory Package Spring-Latch Connections Without Solder Reflow
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The reliability of memory systems is compromised by thermal cycles during the reflow process, which can introduce cracks in solder joints and warp the package or printed circuit board, leading to mechanical and electrical connection issues.
Innovation Solution
A connection system is introduced that replaces solder balls with springs and latches, allowing the package to be coupled with the PCB via deformable springs and secured with latches, providing both electrical and mechanical connections without the need for high-temperature reflow processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used to connect the package with the PCB, then electrical connection is achieved, but thermal cycles during reflow process cause cracks in solder joints and warping, reducing reliability
Solution Approach 1:
The patent removes solder balls from the connection system entirely, extracting the harmful element that causes thermal damage. The package is directly coupled with the PCB using mechanical latches and conductive traces, eliminating the reflow process and associated thermal cycles that cause cracks and warping.
Solution Approach 2:
The patent replaces the thermal-based soldering process with a mechanical attachment system. Latches with spring arms provide mechanical coupling between the package and PCB, while electrical connection is established through conductive traces and contact pads, substituting the thermal field with mechanical and electrical fields.
2Strength
If high-temperature reflow process is used to attach solder balls, then mechanical connection is achieved, but package warping and PCB deformation occur, leading to connection issues
Solution Approach 1:
The patent introduces latches as intermediary mechanical components between the package and PCB. These latches with spring arms provide the necessary mechanical connection strength without requiring high-temperature processes, acting as a mediator that achieves strong coupling while preserving the shape integrity of both package and PCB.
3Reliability
If solder balls are used for connection, then electrical conductivity is achieved, but cracks develop during thermal cycling, reducing connection reliability
Solution Approach 1:
The patent replaces the solder-based electrical connection with a direct trace-to-pad conductive path. Electrical signals flow through PCB traces to contact pads on the package, eliminating the solder joints that are susceptible to thermal fatigue and cracking, thereby extending the service life under thermal cycling conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the memory system by reducing defects such as cracks and warping, ensuring stable connections at lower temperatures and improving the overall performance of memory operations.
Implementation Method 1
Each spring may include a material configured to deform based at least in part on a shape of the package, a shape of the PCB, or both
Data Source
AI summary
Methods, systems, and devices for connection designs for memory systems are described. A memory system may include a package and a printed circuit board (PCB). An interface of the package may be coupled with the PCB via a set of springs, where each spring may include a material configured to deform based at least in part on a shape of the package, a shape of the PCB, or both. The memory system may also include a set of latches that may secure the package in a fixed position relative to the PCB. That is, the set of springs may provide an electrical connection between the package and the PCB, and the set of latches may provide a mechanical connection between the package and the PCB. In some examples, the package, the PCB, or both, may include one or more connection structures configured to receive the latches.