Memory Stack Buffer Chip Layout for Low-Interference Signal Routing
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Solution Overview
Problem
As electronic devices become smaller and more complex, signal transmission paths in semiconductor packages experience increased interference, affecting signal integrity and stability.
Innovation Solution
A semiconductor package design featuring buffer chips with symmetrical chip pads connected via a single-point type connection to a package substrate, minimizing signal interference by reducing complex wiring configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If buffer chips are arranged with multiple connection points to substrate pads, then connectivity is improved, but signal interference between internal wires increases
Solution Approach 1:
The patent extracts the harmful multiple connection paths and replaces them with a single connection point. By using a single-point type connection where the right first chip pad and left second chip pad connect to the same substrate pad, the patent eliminates the interference caused by parallel wire paths while maintaining necessary connectivity.
Solution Approach 2:
The patent employs asymmetrical arrangement of chip pads and connection points. The first and second buffer chips are positioned asymmetrically with respect to the substrate, and their chip pads connect to substrate pads in an asymmetric pattern. This asymmetry prevents symmetrical wire routing that would create parallel interference paths, thereby reducing signal interference.
2Adaptability or versatility
If complex wiring configurations are used to connect chip pads to substrate pads, then connectivity and functionality are improved, but signal interference and transmission instability increase
Solution Approach 1:
The patent removes complex wiring configurations and replaces them with simplified direct connections. The chip pads are positioned and connected such that signal paths are minimized and simplified, eliminating the need for complex routing while maintaining full connectivity between buffer chips and substrate pads.
Solution Approach 2:
Instead of routing signals through complex internal wiring, the patent inverts the approach by positioning chip pads to connect directly to substrate pads with minimal intermediate routing. This inversion of the traditional wiring approach simplifies the signal path and reduces interference.
3Area of stationary object
If buffer chips are positioned closer together to reduce package size, then package compactness is improved, but signal interference between adjacent chips increases
Solution Approach 1:
The patent uses asymmetrical positioning of the first and second buffer chips on the substrate. The chips are not placed in symmetrical positions that would create equal-distance parallel signal paths, but rather in asymmetric positions that stagger the signal paths and reduce coupling between adjacent chips, thereby minimizing interference while maintaining compact packaging.
Solution Approach 2:
The patent applies local quality by optimizing the specific positioning and orientation of each buffer chip individually. The chip pads are positioned at specific locations on each chip to achieve optimal connection geometry with substrate pads, creating locally optimized signal paths that minimize interference even in compact arrangements.
Data Source
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Figure 2A
AI summary
A semiconductor package, including: a package substrate (100); a chip unit (200) including a first semiconductor chip (200-1) and a second semiconductor chip (200-2); a first chip stack structure (300) and a second chip stack structure (400), wherein the first semiconductor chip (200-1) includes a first chip body (210-1), a left first chip pad (210-1), and a right first chip pad (220-1), wherein the second semiconductor chip (200-2) includes a second chip body (210-2), a left second chip pad (220-2), and a right second chip pad (230-2), wherein the left first chip pad (210-1) is connected to the first chip stack structure (300), the right second chip pad (230-2) is connected to the second chip stack structure (400), and the right first chip pad (220-1) and the left second chip pad (220-2) are symmetrical and connected to a substrate pad (120) included in the package substrate (100) using a single-point type connection.