Memory Staircase Support Structures to Prevent Collapse
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Solution Overview
Problem
Conventional techniques for fabricating memory devices face challenges with structural collapse during the manufacturing process, particularly at staircase regions, due to the small dimensions of components, which can lead to increased costs with additional chemical process steps.
Innovation Solution
The implementation of support structures with specific dimensions and dimension relationships at the staircase regions of memory devices, along with the use of a reticle configured for lithography systems to pattern these support structures, prevents potential collapse during the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If additional chemical process steps are used to prevent structural collapse, then structural stability is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies preliminary action by forming support structures at staircase regions before the collapse-prone fabrication steps. These support structures are created in advance to prevent structural collapse during subsequent processing, eliminating the need for additional chemical process steps and reducing manufacturing costs while maintaining structural stability
2Productivity
If component dimensions are reduced to increase device density, then device integration is improved, but structural stability deteriorates
Solution Approach 1:
The patent applies local quality by providing structural support specifically at staircase regions where collapse is most likely to occur, rather than uniformly supporting the entire structure. This localized approach maintains structural stability at reduced dimensions while minimizing additional material and preserving device integration benefits
3Ease of manufacture
If conventional fabrication processes are used without support structures, then manufacturing simplicity is maintained, but structural collapse occurs
Solution Approach 1:
The patent introduces support structures as intermediary elements that mediate between the fabrication process and the vulnerable staircase regions. These support structures act as temporary scaffolding during fabrication, preventing collapse while allowing conventional processes to proceed, and are later removed to leave the final device structure
Data Source
AI summary
Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes tiers of respective memory cells and control gates, the tier located one over another over a substrate, the control gates including a control gate closest to the substrate, the control gates including respective portions forming a staircase structure; conductive contacts contacting the control gates at a location of the staircase structure, the conductive contacts including a conductive contact contacting the control gate; a dielectric structure located on sidewalls of the control gates; and support structures adjacent the conductive contacts and having lengths extending vertically from the substrate, the support structures including a support structure closest to the conductive contact, the support structure located at a distance from an edge of the dielectric structure, wherein a ratio of a width of the support structure over the distance is ranging from 1.6 to 2.0.