Isothermal Cooling for Memory Sub-System Enclosure
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Solution Overview
Problem
Memory sub-systems face thermal challenges due to unbalanced heat load on PCBs, leading to potential data loss and damage from overheating, as existing thermal throttling methods are insufficient in managing temperature across asymmetric enclosure designs.
Innovation Solution
The implementation of an isothermal cooling system using a heat spreader and heat sink configuration, coupled with a vapor chamber, to effectively transfer heat between the top and bottom enclosures, balancing heat distribution and preventing hot spots, thereby enhancing thermal efficiency and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal throttling is used to manage temperature, then temperature control is improved, but processing speed is reduced
Solution Approach 1:
The patent applies preliminary action by pre-positioning heat sinks and heat spreaders on the PCB before thermal throttling becomes necessary. The thermal management infrastructure is built in advance, allowing the system to handle heat more effectively without immediately reducing processing speed when temperature thresholds are reached.
Solution Approach 2:
The patent introduces heat spreaders and heat sinks as intermediary components between the memory components and the environment. These intermediaries actively manage heat transfer, allowing the system to maintain higher processing speeds by preventing direct thermal coupling between components and the housing, thereby delaying or reducing the need for thermal throttling.
2Productivity
If heat is concentrated on one side of the PCB, then component density is improved, but temperature distribution is worsened
Solution Approach 1:
The patent applies local quality by placing heat sinks and heat spreaders specifically at locations where heat concentration occurs on the PCB. Rather than uniform distribution, the thermal management components are strategically positioned to address local hot spots, allowing high component density in certain areas while maintaining acceptable temperature distribution through targeted heat dissipation.
Solution Approach 2:
The patent addresses temperature distribution by adding a vertical dimension to heat management through 3D heat sink structures and multi-layer heat spreaders. This three-dimensional thermal management approach allows heat to be distributed not only across the PCB surface but also vertically, enabling higher component density on the PCB while managing thermal load through spatial distribution in multiple dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves heat transfer efficiency, increases the amount of heat that can be generated before thermal throttling occurs, and ensures more even temperature distribution across the memory sub-system, enhancing its reliability and operational stability.
Implementation Method 1
a bottom heat spreader that allows distribution of heat among components on a bottom of a PCB enclosed in the memory sub-system enclosure
Implementation Method 2
coupled with a vapor chamber, to effectively transfer heat between the top and bottom enclosures
Implementation Method 3
coupled with a vapor chamber, to effectively transfer heat between the top and bottom enclosures
Implementation Method 4
a top portion that comprises a plurality of fins configured to radiate heat into an environment of the memory sub-system enclosure
Implementation Method 5
a top portion that comprises a plurality of fins configured to radiate heat into an environment of the memory sub-system enclosure
Data Source
AI summary
Aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. A PCB assembly may be secured between a heat spreader and a heat sink that are thermally coupled. The heat sink radiates heat absorbed from both sides of the PCB assembly. By connecting the heat spreader to the heat sink, heat is more effectively transferred from the side of the PCB assembly not directly connected to the heat sink. The PCB assembly may be secured between a top enclosure and a bottom enclosure. The top enclosure and the bottom enclosure may be thermally coupled using a vapor chamber. The vapor chamber pumps heat from a higher-temperature side of the PCB assembly to a lower-temperature side of the PCB assembly. By using the vapor chamber to thermally couple the top and bottom enclosures, creation of hot spots is avoided.