Memory Sub-System Temperature Regulation via Dynamic Data Transfer

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing memory sub-systems face challenges in dynamically regulating temperature, particularly during save and restore operations, which can lead to increased temperatures beyond acceptable limits.

Innovation Solution

Incorporating a temperature component within the memory sub-system or its controller that monitors temperature values and adjusts data transfer parameters, such as data size or transfer speed, to maintain temperatures within a safe range.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If data transfer operations are performed at high speed in memory sub-systems, then productivity is improved, but temperature increases beyond acceptable limits

Engineering Contradiction:
Improvedata transfer speedVSAvoidmemory sub-system temperature
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent implements dynamic temperature regulation by continuously monitoring temperature values and adjusting data transfer parameters in real-time. The system transitions from static to dynamic operation, modifying data size or transfer speed based on current temperature conditions to maintain temperatures within acceptable limits while maximizing productivity.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes operational parameters (data size, transfer speed) based on temperature thresholds. When temperature exceeds acceptable limits, the system modifies these parameters to reduce thermal generation, directly addressing the contradiction between high-speed operation and temperature control.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If data size is increased to improve throughput, then productivity is improved, but temperature increases beyond acceptable limits

Engineering Contradiction:
Improvedata throughputVSAvoidmemory sub-system temperature
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The system dynamically adjusts data size based on temperature feedback. Instead of using a fixed data size for all operations, the system modifies the data size parameter in response to temperature conditions, allowing high throughput when temperatures are acceptable and reducing data size when temperatures approach limits.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent incorporates temperature monitoring and feedback mechanisms that inform subsequent data transfer decisions. The system uses temperature threshold comparisons to feedback control the selection of data size, creating a closed-loop system that balances throughput and temperature.

Inventive Principle:
Principle #23Feedback

Data Source

PatentEP4078583B1Memory sub-system temperature regulation
Publication Date: 2025.01.29 MICRON TECHNOLOGY INC
  • EP4078583B1 patent drawingFigure 1
  • EP4078583B1 patent drawingFigure 2
  • EP4078583B1 patent drawingFigure 3

AI summary

A method includes determining, by a first component of a memory sub-system controller, a first temperature value of the memory subsystem controller. The method can further include determining, by a second component of a non-volatile memory device, a second temperature value of the non-volatile memory device coupled to the memory sub-system controller. The method can further include modifying a data parameter in response to at least one of the first temperature value or the second temperature value exceeding a threshold temperature value.