Memory Substrate Protrusions for Signal Stability

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Solution Overview

Problem

The existing memory systems face deterioration in electric signal characteristics due to positional deviations and contact issues between the connector terminals of the memory system and the host device, leading to instability in signal transmission.

Innovation Solution

The substrate of the memory system incorporates a first connector with a substrate portion featuring a first and second protrusion, formed using laser processing, which ensures high dimensional and positional accuracy, and includes ground layers to stabilize the ground potential, thereby maintaining a favorable contact state between the connector terminals and preventing signal deterioration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional connector terminals are used without protrusions, then the device complexity is reduced, but the manufacturing precision and positional accuracy of connector terminals deteriorate

Engineering Contradiction:
Improvedimensional and positional accuracy of connector terminalsVSAvoidstructure of substrate portion
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The substrate portion is segmented into multiple functional surfaces (first surface with connector terminals, second surface perpendicular to first, third surface opposite to second, fourth surface opposite to third) with protrusions on specific surfaces. This segmentation allows precise positioning of connector terminals on the first surface while using protrusions on other surfaces for alignment and support, thereby achieving high manufacturing precision without excessive overall complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate portion utilizes three-dimensional positioning by providing protrusions on the second surface (perpendicular to first surface) and fourth surface (opposite to third). This multi-dimensional approach ensures precise alignment and contact between connector terminals and corresponding terminals on the host device, achieving high positional accuracy through spatial distribution rather than simple planar arrangement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If ground layers are not provided, then the device complexity is reduced, but the stability of ground potential deteriorates, leading to signal deterioration

Engineering Contradiction:
Improvestability of ground potential and signal transmissionVSAvoidstructure of substrate portion
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Ground layers are provided on the substrate to create equipotential regions that stabilize the ground potential across the connector interface. This ensures that all connector terminals reference the same ground potential, preventing signal deterioration caused by potential differences and improving the reliability of signal transmission between the memory system and host device.

Inventive Principle:
Principle #12Equipotentiality

3Manufacturing precision

If protrusions are added to the substrate portion, then the manufacturing precision is improved, but the ease of manufacture deteriorates

Engineering Contradiction:
Improvepositional accuracy of connector terminalsVSAvoidprocess of forming substrate portion
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The protrusions on the substrate portion are formed through laser processing, which replaces traditional mechanical machining methods. Laser processing achieves high positional accuracy and dimensional precision of connector terminals while avoiding the complexity of mechanical tooling and multi-step machining processes, thereby improving ease of manufacture despite the added geometric complexity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents deterioration in electric signal characteristics by ensuring precise alignment and stable contact between the connector terminals, enhancing the reliability of signal transmission between the memory system and the host device.

Implementation Method 1

formed using laser processing, which ensures high dimensional and positional accuracy

Methodology Applied
Scientific EffectLaser processing: Laser

Data Source

PatentUS12127346B2Substrate and memory system
Publication Date: 2024.10.22 KIOXIA CORP
  • US12127346B2 patent drawing
  • US12127346B2 patent drawing
  • US12127346B2 patent drawing

AI summary

A substrate includes a first connector fittable to a connector of a host device. The first connector includes a plurality of connector terminals arranged in a first direction and a substrate portion including a surface S1 provided with the plurality of connector terminals and extending in the first direction. The substrate portion includes a surface S3 perpendicular to the surface S1, a first protrusion provided on the surface S3 and protruding in the first direction, a surface S4 located on an opposite side of the surface S3, and a second protrusion provided on the surface S4 and protruding in a direction opposite to the first direction.