Memory Substrate Symmetrical Pad Electrodes Stress Distribution
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Solution Overview
Problem
Existing memory systems face challenges in distributing stress evenly across surfaces and managing heat dissipation, leading to potential defects and warpage due to uneven thermal stress and impact, which can cause breakage of components and interconnects.
Innovation Solution
The memory system employs a substrate with symmetrical arrangements of pad electrodes on both surfaces, ensuring balanced stress distribution and effective heat dissipation by positioning critical components like the memory controller near the center and using counterweights to maintain symmetry, thereby reducing thermal stress and preventing concentration of stress on specific areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are mounted on a printed board in a conventional asymmetric arrangement, then the device complexity is reduced and ease of manufacture is improved, but stress distribution becomes uneven and heat dissipation is compromised leading to warpage and component breakage
Solution Approach 1:
The patent applies asymmetry in reverse - it deliberately creates a symmetrical structure where the second surface mirrors the first surface. The substrate has a first surface with components (memory controller, nonvolatile memory) and a second surface with corresponding pad electrodes arranged symmetrically to the first surface, creating a balanced stress distribution that prevents warpage while maintaining manufacturing feasibility
Solution Approach 2:
The patent uses the substrate itself as a counterweight structure. The second surface with its pad electrodes and conductive patterns acts as a counterbalancing element to the components on the first surface, distributing thermal and mechanical stress evenly throughout the substrate thickness, thereby preventing concentration of stress that would lead to breakage
2Temperature
If pad electrodes are arranged asymmetrically on the substrate surfaces, then the manufacturing process is simplified, but heat dissipation becomes uneven causing thermal stress concentration
Solution Approach 1:
The patent creates a symmetrical arrangement where pad electrodes on the second surface are positioned to correspond with components on the first surface. This symmetry ensures that heat generated by components is dissipated uniformly through the substrate, preventing thermal stress concentration while the symmetrical pattern actually simplifies the manufacturing process by providing a regular, repeatable structure
Solution Approach 2:
The symmetrical arrangement of pad electrodes creates equipotential conditions for heat dissipation across the substrate. By distributing the thermal load uniformly through symmetrically arranged conductive paths on both surfaces, the patent ensures that no single area experiences excessive thermal stress, maintaining thermal equilibrium throughout the device
3Reliability
If critical components are positioned away from the center of the substrate, then the device layout is more flexible and easier to assemble, but stress concentration occurs leading to increased risk of interconnect failure
Solution Approach 1:
The patent positions the memory controller and nonvolatile memory near the center of the substrate, creating a balanced, equipotential layout that distributes mechanical and thermal stress uniformly. This central positioning, combined with the symmetrical arrangement of pad electrodes, ensures that interconnects are subjected to equal stress from all directions, preventing concentration that would lead to failure, while still maintaining practical assembly flexibility
Data Source
AI summary
A memory system includes a substrate having a first and second surface, a memory controller, a nonvolatile memory, a first and second part, first and first, second, third, and fourth electrodes. The substrate includes a core portion, first and second pads on the first surface, and third and fourth pads on the second surface. The first electrodes couples the first pads and the memory controller. The second electrodes couples the second pads and the nonvolatile memory. The third electrodes couples the third pads and the first part. The fourth electrodes couples the fourth pads and the second part. The first and third pads are arranged at positions symmetrical to each other with respect to the core portion. The second and fourth pads are arranged at positions symmetrical to each other with respect to the core portion.