Memory Sub-System Temperature Estimation via Sensor Subset

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Solution Overview

Problem

Conventional memory sub-systems face inaccuracies in temperature measurement due to significant temperature gradients, leading to premature degradation and performance issues when operating at critical temperatures.

Innovation Solution

Generating an estimated temperature value by using a subset of component temperature values from multiple components within the memory sub-system, applying offsets to raw temperature values, and removing outlier values to improve accuracy and precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a discrete temperature sensor is used to measure temperature at a particular location, then the measurement is simple and direct, but the temperature measurement is inaccurate due to significant temperature gradients across the memory sub-system

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidtemperature measurement system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent divides the temperature measurement task into multiple segments by using multiple temperature sensors distributed across different locations within the memory sub-system. Each sensor measures the temperature at its specific location, and the controller collects these segmented measurements to compute an average temperature, thereby achieving more accurate overall temperature measurement while accounting for temperature gradients.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent combines multiple individual temperature measurements from different sensor locations into a single average temperature value. The controller merges the temperature data from all sensors by calculating the arithmetic mean, providing a comprehensive representation of the sub-system's temperature that overcomes the inaccuracy of single-point measurements.

Inventive Principle:
Principle #5Merging (Combining)

2Measurement precision

If multiple temperature sensors are used across different components, then the temperature measurement accuracy is improved, but the device complexity and data processing requirements increase

Engineering Contradiction:
Improvetemperature estimation accuracyVSAvoidtemperature monitoring system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The controller performs multiple functions using the same temperature data: it calculates the average temperature for monitoring purposes, compares the temperature against threshold values for thermal management, and uses the temperature information for performance optimization. This multi-functional approach reduces the need for separate processing systems while improving temperature measurement accuracy.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system implements feedback by continuously monitoring temperature from multiple sensors, comparing the average temperature against predefined thresholds, and using this information to adjust system operation. The controller provides feedback signals to modify workload distribution or activate cooling mechanisms when temperature thresholds are exceeded, creating a closed-loop thermal management system.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method provides a more accurate and precise temperature estimate, reducing the time the memory sub-system operates at critical temperatures, thereby extending its lifespan and improving performance.

Implementation Method 1

raw component temperature values that are indicative of a temperature of respective ones of the multiple components

Methodology Applied
Scientific EffectTemperature sensing: Thermistor

Data Source

PatentUS11650642B2Estimating the temperature of a memory sub-system
Publication Date: 2023.05.16 MICRON TECHNOLOGY INC
  • US11650642B2 patent drawing
  • US11650642B2 patent drawing
  • US11650642B2 patent drawing

AI summary

A request for an estimated temperature of a memory sub-system including multiple components can be received. A set of component temperature values based on temperature measurements at the components can be identified. A subset of the component temperature values can be generated by removing one or more of the component temperature values from the set of component temperature values based on one or more criteria. The estimated temperature value that estimates the temperature of the memory sub-system can be generated using the subset of the component temperature values.