Memory Temperature Control via Linear Prediction Model
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Solution Overview
Problem
Conventional memory storage devices rely on a single thermal sensor to measure surface temperature, which is inaccurate for determining the need to reduce speed, as it does not represent the temperature of all memory packages, and this approach inefficiently uses circuit layout space on the PCB substrate.
Innovation Solution
A method and system that establish a linear relationship between internal and surface temperatures of memory packages to predict surface temperatures, allowing for frequency modulation adjustments to prevent overheating without the need for additional thermal sensors, thereby optimizing temperature control and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single thermal sensor is used to measure surface temperature, then the circuit layout space is reduced, but the temperature measurement accuracy deteriorates
Solution Approach 1:
The patent introduces an intermediary mathematical model (linear relationship expression) that connects internally measurable temperatures to the otherwise unmeasurable surface temperature. This model acts as a mediator, allowing accurate surface temperature prediction through internal temperature measurements without requiring direct surface sensors, thus resolving the contradiction between measurement accuracy and circuit space usage.
Solution Approach 2:
The patent creates a virtual copy of the surface temperature measurement capability through mathematical modeling. Instead of physically measuring surface temperature with a sensor, the system calculates a predicted surface temperature based on internal temperature measurements and established linear relationships, effectively copying the measurement function without the physical sensor.
2Area of stationary object
If temperature of a single memory package is measured, then the circuit layout space is saved, but the temperature control accuracy deteriorates
Solution Approach 1:
The patent divides the temperature monitoring task into segments: internal temperature measurement for each memory package and separate linear relationship expressions for each package. By establishing individual linear relationships for each memory package (Tc1=a1×Tj1+b1×Tj21+c1, Tc2=a2×Tj1+b2×Tj22+c2, etc.), the system can predict surface temperatures of all packages using only internal temperature measurements, achieving comprehensive temperature control accuracy without additional sensors.
Solution Approach 2:
The patent creates a universal temperature monitoring system where internal temperature sensors serve multiple functions: measuring internal temperatures directly and indirectly predicting surface temperatures of all memory packages through the linear relationship model. This multi-functional approach eliminates the need for separate surface temperature sensors while maintaining comprehensive temperature monitoring capability.
Data Source
AI summary
A memory temperature controlling method and a memory temperature controlling system are provided. The method includes: performing, by a testing equipment, test modes on a memory storage device, and obtaining a first internal temperature of a memory control circuit unit, a second internal temperature of each memory package and a surface temperature of each memory package to establish a linear relationship expression of the first internal temperature, the second internal temperature and the surface temperature; using, by the memory storage device, the linear relationship expression to calculate a predicted surface temperature of a rewritable non-volatile memory based on a first current internal temperature of the memory control circuit unit and a second current internal temperature of each memory package; adjusting, by the memory storage device, an operating frequency for accessing the rewritable non-volatile memory based on the predicted surface temperature.