Semiconductor Memory Temperature Sensor Array for Hot Spot Detection
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Solution Overview
Problem
Existing semiconductor memory apparatuses face challenges in accurately reflecting temperature increases at 'hot spots' due to the separation between temperature sensors and memory blocks, leading to unreliable data storage as the refresh operation cycle is not adequately adjusted.
Innovation Solution
The implementation of a semiconductor memory apparatus with multiple temperature sensors adjacent to memory blocks, which output preliminary temperature sensing signals, and a temperature comparison unit to determine the highest temperature, allowing the temperature-compensated self-refresh circuit to adjust the refresh cycle accordingly, ensuring accurate temperature reflection and data reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single temperature sensor is used in the peripheral circuit area, then the device complexity is reduced, but the temperature detection precision at hot spots deteriorates
Solution Approach 1:
The patent divides the temperature sensing function into multiple segments by placing temperature sensors in each memory block adjacent to the memory cells. This segmentation allows each sensor to independently monitor the temperature of its local memory block, providing precise temperature detection at hot spots without requiring a complex centralized sensing system.
Solution Approach 2:
The patent transitions from a single centralized temperature sensor to a two-dimensional array of temperature sensors distributed across multiple memory blocks. This spatial distribution in another dimension enables comprehensive temperature monitoring across the entire memory apparatus, accurately capturing temperature variations at different locations including hot spots.
2Measurement precision
If temperature sensors are placed adjacent to each memory block, then the temperature detection precision is improved, but the device complexity increases
Solution Approach 1:
The patent implements a universal temperature comparison unit that can process temperature sensing signals from multiple memory blocks using the same comparison logic. This multi-functional unit selectively determines the highest temperature signal among all memory blocks, managing the complexity of multiple sensors through a standardized processing approach rather than requiring separate processing circuits for each sensor.
Solution Approach 2:
The patent merges the temperature comparison functionality into a unified circuit that consolidates temperature signals from all memory blocks into a single highest temperature output. This merging approach reduces the overall system complexity by combining multiple sensing functions into one integrated temperature management unit, rather than maintaining separate control circuits for each memory block.
3Device complexity
If the refresh operation cycle is not adjusted for temperature increases, then the device complexity is reduced, but the data storage reliability deteriorates
Solution Approach 1:
The patent implements a feedback mechanism where the temperature comparison unit continuously monitors temperature signals from all memory blocks and feeds back the highest temperature information to the refresh control circuit. This feedback loop enables the refresh operation cycle to be dynamically adjusted based on actual temperature conditions, ensuring data storage reliability while maintaining a relatively simple control structure through automated temperature-based control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise temperature detection and stable refresh cycle control, improving the reliability of data storage by accurately reflecting temperature increases and adjusting the refresh operation, thus maintaining data integrity even at hot spots.
Implementation Method 1
a plurality of temperature sensors disposed adjacent to the respective memory blocks and configured to output a plurality of preliminary temperature sensing signals whose voltage levels are controlled in response to temperature change
Data Source
AI summary
A semiconductor memory apparatus includes: a plurality of memory blocks; and a plurality of temperature sensors disposed adjacent to the respective memory blocks and configured to output a plurality of preliminary temperature sensing signals whose voltage levels are controlled in response to temperature change. A preliminary temperature sensing signal indicating the highest temperature among the plurality of preliminary temperature sensing signals is detected and used as a temperature sensing signal.