Semiconductor Memory Temperature Detection Module Design
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Solution Overview
Problem
Semiconductor memory chips face challenges in writing stability and time when operating in low-temperature environments, as increased resistances in bit lines and metal connections prolong writing times and reduce stability.
Innovation Solution
A semiconductor device with a temperature detection module that uses multiple temperature detection units sharing a processing unit to detect temperatures and control the starting of memory chips, ensuring they operate above a set threshold, thereby improving writing stability and reducing writing time. The module is designed to occupy a small area without affecting the memory chip's effective area, with independent power sources for the detection and memory chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If temperature detection units are added to each memory chip to detect temperatures, then the writing stability and time are improved, but the device complexity and area occupation increase
Solution Approach 1:
Multiple temperature detection units share a common processing unit to process temperature signals. This merging approach reduces the overall device complexity and area occupation while maintaining the temperature detection capability across multiple memory chips, thereby improving writing stability without proportionally increasing system complexity
Solution Approach 2:
The processing unit is designed with multi-functionality to handle temperature detection signals from multiple temperature detection units. This universal component performs signal processing for all detection units, reducing the need for separate processing circuits for each memory chip and minimizing area occupation
2Measurement precision
If multiple temperature detection units are implemented with independent processing units, then the temperature detection precision is improved, but the area occupation increases and affects memory chip effective area
Solution Approach 1:
Multiple temperature detection units share a common processing unit, which significantly reduces the area occupied by processing circuits compared to having independent processing units for each detection unit. This sharing approach maintains temperature detection precision while preserving more effective area for memory operations
Solution Approach 2:
The patent implements a hierarchical structure where multiple temperature detection units (spatial distribution) connect to a shared processing unit through signal lines. This dimensional arrangement allows precise temperature monitoring across multiple chips without proportionally increasing the area occupied by processing logic, as the processing function is consolidated in one location
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents memory chips from starting at low temperatures, shortens writing time, and enhances writing stability by ensuring optimal operating conditions, while maintaining a compact design that does not interfere with the memory chip's area.
Implementation Method 1
a temperature detection unit (111) disposed on each of the plurality of memory chips (100) to detect a temperature of a corresponding one of the memory chips (100)
Data Source
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AI summary
A semiconductor device is provided, comprising a plurality of memory chips and a temperature detection module. The temperature detection module comprises: a plurality of temperature detection units, in which the plurality of temperature detection units are disposed on at least part of the memory chips to detect the temperatures of at least part of the memory chips; and a processing unit, in which the plurality of temperature detection units share the processing unit with each other, and the processing unit is configured to process a signal of at least one of the temperature detection units. The temperature detection module is configured to detect the temperature of the memory chip, and the temperature detected by the temperature detection module provides a reference for starting and running of the memory chip, thereby preventing the memory chip from starting and running at a low temperature, shortening the writing time, and improving the writing stability of the memory chip. In addition, the circuit structure of the temperature detection module is simple and easy to implement, and the temperature detection units share the processing unit with each other, so that the temperature detection module occupies a small area, and the effective area of the memory chip may not be affected.