Memory Die Temperature Feedback for Dynamic Power Budgeting
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Solution Overview
Problem
Memory systems face challenges in efficiently managing power consumption due to temperature variations, leading to either over-allocation at low temperatures or insufficient power at high temperatures, affecting the performance and efficiency of access operations.
Innovation Solution
The memory system dynamically adjusts power consumption based on measured temperatures of memory dies, providing a dynamic indication of power usage to allocate resources effectively without exceeding a total power budget.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power consumption is budgeted for high temperature operations, then power leakage is accounted for, but power is wasted when temperature is low
Solution Approach 1:
The patent implements dynamic power budgeting by continuously monitoring the temperature of memory dies and adjusting the power consumption budget in real-time. Instead of using a static high-temperature budget, the system adapts the power allocation based on actual thermal conditions, thereby eliminating power waste during low-temperature operations while maintaining reliability during high-temperature operations.
Solution Approach 2:
The system incorporates temperature sensing and feedback mechanisms that monitor the actual temperature of memory dies and use this information to dynamically adjust the power budget. This closed-loop feedback ensures that power allocation matches actual operational needs, preventing both power waste during cool operations and insufficient power during hot operations.
2Use of energy by moving object
If power consumption is budgeted for low temperature operations, then power efficiency is improved, but power leakage causes insufficient power at high temperatures
Solution Approach 1:
The system dynamically adjusts power budgeting based on real-time temperature monitoring of memory dies. When temperatures are low, the system operates with a reduced power budget to maintain efficiency, and when temperatures rise, the power budget is automatically increased to account for thermal leakage, ensuring sufficient power availability across all operating conditions.
Solution Approach 2:
Temperature feedback from memory die sensors triggers dynamic power budget adjustments. The system continuously monitors thermal conditions and modifies power allocation accordingly, ensuring that power efficiency is maintained during cool operations while preventing power insufficiency during hot operations through automatic budget escalation.
3Device complexity
If a fixed power budget is used, then system complexity is reduced, but performance optimization is limited
Solution Approach 1:
The patent implements dynamic power budgeting that automatically adjusts power allocation based on real-time temperature monitoring of memory dies. This dynamic approach optimizes access operation performance by providing appropriate power levels matched to thermal conditions without requiring complex manual intervention, achieving performance optimization with manageable system complexity.
Data Source
AI summary
Methods, systems, and devices for temperature based power indication are described. A memory system may be configured to dynamically provide power based on measured temperatures of the memory dies. A controller of the memory system may be configured to provide a dynamic indication of power consumption associated with a measured temperature of a memory die. For example, the controller may identify a data transfer operation for a memory die and monitor a temperature of the memory die. The controller may determine an estimated power usage for the data transfer operation based on the temperature and skew information of the memory die. Then, the controller may transmit an indication of the estimated power usage to the memory dies, and the memory dies may adjust a power budget for performing other operations based on the estimated power usage.