Memory Module Thermal Telemetry for Dynamic Data Re-mapping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Information handling systems face challenges in efficiently managing thermal conditions within memory modules, leading to potential overheating and increased power consumption, which can impact performance and reliability.
Innovation Solution
The implementation of thermal telemetry systems that include multiple thermal sensors and a central processing unit to monitor localized temperatures and dynamically re-map data access from overheated memory ranks to spare ranks, optimizing temperature management and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal telemetry monitoring and dynamic re-mapping is implemented, then temperature management is optimized and power consumption is reduced, but device complexity increases
Solution Approach 1:
The system proactively monitors thermal conditions using multiple thermal sensors and re-maps data access from memory ranks approaching thermal thresholds before actual overheating occurs. This preventive approach avoids the need for more aggressive cooling infrastructure while maintaining reliable operation.
Solution Approach 2:
The system continuously receives thermal telemetry data from sensors positioned at multiple locations within the memory module, processes this feedback information, and dynamically adjusts data access patterns accordingly. This closed-loop control enables adaptive thermal management without requiring complex hardware modifications.
2Measurement precision
If multiple thermal sensors are deployed within memory modules, then localized temperature monitoring precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The system implements thermal sensors at specific strategic locations within the memory module where localized hot spots are most likely to occur. This targeted approach provides precise measurement of critical thermal zones without the need for comprehensive sensor coverage throughout the entire module.
Solution Approach 2:
The patent replaces complex mechanical thermal management systems with electronic thermal sensing and software-based thermal management. By using multiple simple thermal sensors combined with intelligent data access re-mapping, the system achieves effective thermal control without mechanical moving parts or complex physical infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively maintains memory temperatures below threshold levels, optimizing performance and reducing power usage by strategically re-allocating data access, thereby enhancing the overall efficiency and reliability of information handling systems.
Implementation Method 1
The central processing unit may receive first thermal telemetry data for the first memory module from the first thermal sensors
Data Source
AI summary
An information handling system includes first and second memory modules, and a central processing unit. The first memory module includes one or more memory ranks of memory devices, and a first plurality of thermal sensors. The second memory module includes one or more memory ranks of memory devices, and a second plurality of thermal sensors. The central processing unit receives first thermal telemetry data for the first memory module from the first thermal sensors, and second thermal telemetry data for the second memory module from the second thermal sensors. In response to the reception of the first thermal telemetry data, the central processing unit determines a first localized temperature of a first memory rank. In response to the first localized temperature exceeding a threshold temperature, the central processing unit re-maps access of data from the first memory rank to a second memory rank.