MEMS Accelerometer Stud Mounting for Vibration Monitoring

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Solution Overview

Problem

Traditional MEMS accelerometers face challenges in industrial applications due to their limited frequency range, bulky size, unreliable mounting, and sensitivity to temperature changes, making them unsuitable for precise machine monitoring in industrial settings.

Innovation Solution

A MEMS accelerometer device integrated with a printed circuit board (PCB) and a stud configured for secure mounting within a machine housing, featuring a small, sensitive accelerometer chip with improved temperature stability and internal temperature measurement capabilities, and electrical isolation to prevent ground loops.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If traditional mechanical accelerometers are mounted externally on the side of the machine, then the device can be installed on machines, but the device relies on a precisely machined surface to maintain an adequately rigid position and provides unreliable measurements

Engineering Contradiction:
ImproveInstallation easeVSAvoidMeasurement reliability
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The patent combines the accelerometer sensor chip, PCB, and mounting stud into a single integrated device. The stud is threaded directly into the machine housing aperture, eliminating the need for separate mounting brackets and precisely machined surfaces. This integration ensures rigid positioning while simplifying installation to a single screw-in operation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The threaded stud acts as an intermediary element between the accelerometer device and the machine housing. It provides a reliable mechanical connection that does not require precise machining of the housing surface, instead using standard threaded apertures for easy installation while maintaining rigid positioning for accurate measurements.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If MEMS accelerometers are manufactured in a microchip format and installed on a printed circuit board, then the device can be compact, but the location of the printed circuit board is typically unrelated to an optimal position of the sensor

Engineering Contradiction:
ImproveDevice sizeVSAvoidSensor positioning accuracy
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The patent merges the sensor chip, PCB, and mounting structure into a single integrated unit. The stud with threaded body is designed to be inserted directly into the machine housing aperture, positioning the sensor optimally for vibration measurement while maintaining the compact microchip format. This eliminates the problem of PCB location being unrelated to optimal sensor positioning.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If traditional accelerometers are used in industrial applications, then the device can measure acceleration, but the device is relatively bulky and often located relatively far from the vibration transmitting components

Engineering Contradiction:
ImproveVibration measurement capabilityVSAvoidDevice size and position
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The patent replaces traditional mechanical accelerometer assemblies with a compact MEMS sensor chip mounted on a PCB. This substitution dramatically reduces the device size and allows it to be positioned closer to vibration transmitting components while maintaining accurate vibration measurement capability through the integrated stud mounting system.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Speed

If MEMS accelerometers are used for high-frequency measurements, then the frequency range is improved, but the device sensitivity is affected by temperature changes

Engineering Contradiction:
ImproveFrequency measurement rangeVSAvoidTemperature sensitivity
Core Design Contradiction:
SpeedVSMeasurement precision

Solution Approach 1:

The patent addresses temperature sensitivity by incorporating temperature compensation mechanisms and selecting MEMS sensor chips with improved temperature stability. The device includes temperature sensing capabilities that allow for real-time compensation of temperature-induced drift, maintaining measurement precision across wide temperature ranges while preserving high-frequency measurement capability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides accurate, reliable, and easy-to-install measurements with reduced sensitivity to temperature changes and improved frequency range, addressing the limitations of traditional MEMS accelerometers and mechanical accelerometers.

Implementation Method 1

One type of sensor is an accelerometer, which measures acceleration of a machine's vibration

Methodology Applied
Scientific EffectAccelerometer: Accelerometer

Implementation Method 2

a stud defining a chamber and having a threaded body configured to fasten into the threaded aperture

Methodology Applied
Scientific EffectMechanical Fastener: Mechanical Fastener

Data Source

PatentUS8700353B2MEMS accelerometer device
Publication Date: 2014.04.15 KHAZANOV YURI
  • US8700353B2 patent drawing
  • US8700353B2 patent drawing
  • US8700353B2 patent drawing

AI summary

A MEMS accelerometer device for use with a machine having a housing with a threaded aperture, and an external data acquisition system, the device including a stud defining a chamber and having a threaded body configured to fasten into the threaded aperture, a printed circuit board disposed in the chamber, an accelerometer sensor chip mounted on and electrically connected to the printed circuit board, and a communication device electrically connected to the printed circuit board and configured for providing measurement data to the data acquisition system.