MEMS Acoustic Sensor Vertical Lead Routing
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Solution Overview
Problem
Conventional MEMS acoustic sensors face limitations in design freedom and space utilization due to lateral lead wire connections, which hinder diaphragm movement and lead to stress-related precision issues during assembly.
Innovation Solution
The MEMS acoustic sensor design features a back plate with through holes, anchors, and a stress release unit that allows electrical connections to be made on the upper side, enabling stress release without additional apparatus and maintaining diaphragm resonant frequency and rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If lateral lead wire connections are used for electrical connections, then the sensor can be assembled, but design freedom is reduced and space utilization is hindered
Solution Approach 1:
The patent transitions the electrical connection approach from lateral (in-plane) to vertical (out-of-plane) by routing lead wires through the back plate thickness direction. This dimensional change allows connections to be made on the upper side of the back plate, significantly improving design freedom and space utilization while reducing structural complexity.
Solution Approach 2:
Instead of extending lead wires laterally from the diaphragm edge, the patent inverts the connection approach by passing lead wires vertically through the back plate from the upper side to the lower side, where they connect to electrode pads. This inversion resolves the space utilization and design freedom issues caused by lateral extensions.
2Ease of operation
If lateral lead wire connections are used, then electrical connection is achieved, but diaphragm movement is hindered
Solution Approach 1:
The patent moves the lead wire connection from the horizontal plane (lateral extension) to the vertical plane (through-back-plate routing). This dimensional transition eliminates the physical obstruction of lateral lead wires to diaphragm movement while maintaining electrical connectivity through the vertically routed wires and upper-side connection pads.
3Strength
If the back plate is completely filled during assembly, then structural integrity is achieved, but stress deformation occurs reducing precision
Solution Approach 1:
The patent segments the back plate structure by creating through holes that pass completely through the back plate thickness. This segmentation allows the lead wires to penetrate through the back plate and connect to electrode pads on the upper side, enabling stress release during assembly while maintaining overall structural integrity through the distributed through-hole configuration.
Solution Approach 2:
The patent modifies the back plate's physical structure by introducing through holes, changing it from a solid filled structure to a perforated structure. This parameter change enables stress release pathways during assembly, preventing stress-induced deformation and maintaining manufacturing precision while preserving structural integrity through the engineered hole pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances design freedom, space utilization, and precision by allowing natural stress release and maintaining diaphragm performance, preventing deformation and ensuring high sensitivity and signal quality.
Implementation Method 1
a diaphragm (110) which is supported by the at least one anchor and deformed by a sound wave introduced from the outside through the cavity
Implementation Method 2
sensing and measuring a change in the capacity of the microphone capacitor
Data Source
AI summary
The present invention relates to a MEMS acoustic sensor for sensing variable capacitance between a flexible diaphragm and a back plate. The MEMS acoustic sensor is composed of a substrate comprising a cavity, a back plate supported on the substrate and comprising a plurality of through holes, an electrode formed on the inner surface of the back plate, at least one anchor protruding from the back plate toward the substrate, a diaphragm supported by the at least one anchor and deformed by a sound wave introduced from the outside through the cavity, and a stress release unit extending from the edge portion of the back plate and in contact with the substrate.