MEMS Actuator Vertical Actuation via Copper Coil
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Solution Overview
Problem
Current approaches for forming MEMS actuators and relays lack an efficient method for vertical actuation, which is essential for providing reliable low-impedance and high-impedance electrical pathways.
Innovation Solution
A method involving a conventionally formed single-crystal silicon semiconductor wafer with a dielectric layer and metal interconnect structure, where a seed layer, copper, and magnetic materials are used to form a square coil and core member, along with a flexible member that can move vertically, utilizing electroplating and photolithographic processes to create the necessary actuation and switch mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional MEMS fabrication processes are used, then semiconductor device formation is achieved, but vertical actuation capability is lacking
Solution Approach 1:
The patent introduces vertical actuation by adding a third dimension to the conventional planar MEMS structure. A flexible support layer is formed extending vertically from the substrate, with a movable element positioned at its end. This vertical configuration enables actuation in the Z-direction, transitioning from traditional in-plane motion to out-of-plane motion, thereby achieving reliable low-impedance and high-impedance electrical pathways.
2Reliability
If electromagnetic actuation is implemented, then switching function is achieved, but processing temperature requirements increase
Solution Approach 1:
The patent modifies the electromagnetic actuation parameters by using a flexible support layer made of materials with appropriate mechanical and electrical properties. The flexible support layer is formed with specific thickness and material composition to enable electromagnetic actuation at reduced temperatures. This allows the movable element to respond to electromagnetic fields while maintaining structural integrity at lower processing temperatures, making the process compatible with backend CMOS fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of MEMS actuators and relays with effective vertical actuation, achieving forces suitable for good ohmic contact and allowing for the creation of low-impedance and high-impedance electrical pathways, while being compatible with conventional backend CMOS processes and requiring relatively low processing temperatures.
Implementation Method 1
A method involving a conventionally formed single-crystal silicon semiconductor wafer with a dielectric layer and metal interconnect structure, where a seed layer, copper, and magnetic materials are used to form a square coil and core member
Implementation Method 2
achieving forces suitable for good ohmic contact and allowing for the creation of low-impedance and high-impedance electrical pathways
Implementation Method 3
utilizing electroplating and photolithographic processes to create the necessary actuation and switch mechanisms
Data Source
AI summary
A micro-electromechanical (MEMS) actuator and relay are implemented using a copper coil and a magnetic core. The magnetic core includes a base section that lies within the copper coil, and a cantilever section that lies outside of the copper coil. The presence of a magnetic field in the coil causes the cantilever section to move vertically away from a rest position, while the absence of the magnetic field allows the cantilever section to return to the rest position.