MEMS Adhesion Layer Protection for Burr-Free Cutting
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Solution Overview
Problem
The existing methods for manufacturing MEMS devices with two substrates joined by an adhesive face challenges such as burr generation and reduced adhesion strength due to manufacturing variations, leading to reliability issues in liquid ejecting heads.
Innovation Solution
The proposed solution involves a configuration where a flexibly deformable thin film member is laminated on a first substrate, and an adhesion layer extends beyond the substrate's edge, with a protection layer formed outside the substrate to prevent burr formation and enhance adhesion strength, allowing for reliable cutting and etching without damaging the adhesion layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cutting force is strengthened to secure reliable cutting, then cutting reliability is improved, but adhesive chipping and foreign substance generation increase
Solution Approach 1:
A protection layer is introduced as an intermediary element between the adhesive and the cutting interface. This protection layer absorbs the mechanical stress during cutting, preventing direct contact between the cutting tool and the adhesive, thereby eliminating adhesive chipping and foreign substance generation while maintaining cutting reliability
Solution Approach 2:
The protection layer is formed in advance before the cutting process. By pre-positioning this protective barrier, the system prepares for the cutting operation beforehand, ensuring that the adhesive is shielded from mechanical stresses that would otherwise cause chipping during the cutting process
2Strength
If adhesive area is expanded to increase adhesion strength, then adhesion strength is improved, but substrate size must be enlarged
Solution Approach 1:
The protection layer extends the adhesive area into a new dimensional space beyond the substrate edges. By projecting the adhesive layer outward in the lateral dimension, the system increases the effective bonding area without enlarging the substrate itself, thereby enhancing adhesion strength while maintaining compact substrate dimensions
3Strength
If adhesive is positioned on cutting line for joining substrates, then substrate joining is achieved, but burr generation and cutting difficulties occur
Solution Approach 1:
The protection layer serves as a mediator that spatially separates the adhesive from the cutting line. This intermediary structure allows the adhesive to be positioned at the cutting line for effective substrate joining, while simultaneously preventing the adhesive from interfering with the cutting process, thereby eliminating burr generation and cutting difficulties
Solution Approach 2:
The protection layer is formed in advance to create a protective barrier that extends beyond the substrate edges. This preliminary action ensures that when cutting occurs, the adhesive is already shielded, preventing burr generation and cutting failures while maintaining proper substrate joining
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration suppresses burr generation and foreign substance creation during cutting, maintains adhesion strength, and enhances the reliability of MEMS devices and liquid ejecting heads by expanding the adhesion area and using a protection layer to prevent etching solution seepage.
Implementation Method 1
an adhesion layer that adheres the first substrate to the second substrate
Implementation Method 2
a protection layer formed outside the substrate to prevent burr formation and enhance adhesion strength, allowing for reliable cutting and etching without damaging the adhesion layer
Data Source
AI summary
Provided are an MEMS device, a liquid ejecting head, a liquid ejecting apparatus, a manufacturing method of a MEMS device, a manufacturing method of a liquid ejecting head and a manufacturing method of a liquid ejecting apparatus. Provided is a MEMS device that includes a first substrate on which a flexibly deformable thin film member is laminated, a second substrate disposed at an interval with respect to the first substrate, and an adhesion layer that adheres the first substrate to the second substrate, in which an end of the thin film member extends to the outside of the end of the first substrate in an in-plane direction of the first substrate.