MEMS Mounting via Alloy Diffusion Bonding on Electrode Posts
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Solution Overview
Problem
Existing MEMS element mounting techniques on wiring substrates face challenges in achieving sufficient levelness and vacuum airtightness due to adhesive volatility and inadequate adhesion, leading to performance degradation and vacuum leakage.
Innovation Solution
The use of an electrode post made of a metal material with a joining metal layer of a different metal, forming an alloy layer with the connection electrode of the MEMS element, eliminating the need for adhesives and ensuring high precision mounting and vacuum sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive is used to mount MEMS element, then mounting process is simple, but levelness cannot be obtained sufficiently and vacuum airtightness is not enough due to adhesive volatility
Solution Approach 1:
A joining metal layer is introduced as an intermediary between the electrode post and the connection electrode of the MEMS element. This joining metal layer forms an alloy layer through diffusion bonding, eliminating the need for adhesive while achieving both precise levelness and vacuum airtightness. The intermediary layer facilitates metallurgical bonding without the drawbacks of organic adhesives.
Solution Approach 2:
The patent replaces the mechanical/adhesive bonding system with a metallurgical bonding system. Instead of using adhesive to join the MEMS element to the substrate, the invention uses diffusion bonding between metal layers to form a strong, volatile-free alloy layer connection, thereby eliminating vacuum leakage issues.
2Reliability
If adhesive is used to mount MEMS element, then mounting is achieved, but vacuum airtightness is not enough due to volatilization of constituent in the adhesive
Solution Approach 1:
The patent replaces the adhesive-based mounting system with a metallurgical diffusion bonding system. The joining metal layer forms an alloy layer through atomic diffusion, creating a strong bond without organic constituents that can volatilize. This eliminates the harmful vapor emission from adhesive while maintaining reliable mounting.
Solution Approach 2:
The invention changes the bonding mechanism from chemical adhesive bonding to metallurgical diffusion bonding by controlling temperature and time parameters. The joining metal layer is heated to enable atomic diffusion between metals, forming a stable alloy layer that does not volatilize like adhesive constituents.
3Device complexity
If connection electrode is directly connected to electrode post, then structure is simple, but adhesion is inadequate and levelness is insufficient
Solution Approach 1:
A joining metal layer is introduced as an intermediary between the connection electrode and the electrode post. This intermediate layer enables precise alignment and levelness control during mounting while facilitating strong metallurgical bonding through alloy formation, overcoming the limitations of direct connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for high-levelness mounting of MEMS elements and maintains a sufficient vacuum state, enhancing performance and reliability by preventing adhesive volatility and ensuring robust electrical connections even at elevated temperatures.
Implementation Method 1
the connection electrode of the electronic component and the electrode post are joined by an alloy layer including a metal which is different from the metal material of the electrode post
Data Source
AI summary
An electronic component device includes a substrate, an electrode post made of a metal material, provide to stand on the substrate, and an electronic component whose connection electrode is connected to the electrode post, wherein the connection electrode of the electronic component and the electrode post are joined by an alloy layer including a metal which is different from the metal material of the electrode post.