MEMS Cooling Element Anchor Design for Compact Quiet Heat Dissipation
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Solution Overview
Problem
Current cooling solutions for computing devices, such as fans and passive heat spreaders, are inadequate for effectively managing the increasing heat generated by high-performance semiconductor devices, particularly in mobile and larger computing systems, due to space and power constraints, and often result in reduced performance and noise issues.
Innovation Solution
A micro-electro-mechanical systems (MEMS) active cooling system featuring a centrally anchored cooling element that undergoes vibrational motion to drive fluid towards heat-generating structures with high speed and efficiency, utilizing materials with high acoustic velocity and low internal losses, and an adhesive support structure that enhances rotational motion, allowing for efficient heat dissipation in compact form factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional active cooling devices (fans) are used, then cooling effectiveness is improved, but device size and power consumption increase
Solution Approach 1:
The patent employs ultrasonic vibration of a diaphragm membrane to drive fluid flow through micro-orifices, creating a micro-jet cooling effect without requiring traditional rotating fans. The vibrational motion of the diaphragm at ultrasonic frequencies generates sufficient fluid velocity for effective cooling while maintaining a compact form factor suitable for mobile devices.
Solution Approach 2:
The system utilizes pneumatic principles by driving gas or liquid through micro-orifices in the bottom plate using ultrasonic vibration. The fluid dynamics through the micro-orifices create high-velocity jets that enhance convective heat transfer, providing effective cooling in a compact configuration without traditional mechanical fans.
2Volume of moving object
If traditional passive heat spreaders are used, then device size is reduced, but cooling effectiveness decreases
Solution Approach 1:
The ultrasonic vibration of the diaphragm membrane actively drives fluid flow through micro-orifices, creating a dynamic cooling effect that surpasses passive heat spreaders. This vibrational mechanism generates sufficient fluid velocity to enhance convective heat transfer while maintaining a compact device size suitable for mobile applications.
Solution Approach 2:
The system transitions from static passive heat spreading to dynamic active cooling by utilizing ultrasonic vibration to continuously drive fluid flow. The dynamic nature of the ultrasonic vibration creates time-varying pressure differentials that actively pump fluid through the micro-orifices, providing superior cooling effectiveness in a compact form factor.
3Temperature
If cooling systems are incorporated into mobile devices, then cooling effectiveness is improved, but power consumption increases
Solution Approach 1:
The ultrasonic vibration mechanism converts electrical energy directly into mechanical vibration at high frequencies, which then drives fluid flow through the micro-orifices. This direct conversion eliminates the need for intermediate mechanical components and reduces overall power consumption while maintaining effective cooling performance in mobile devices.
Solution Approach 2:
The patent replaces traditional mechanical fan systems with an ultrasonic vibration-based fluid drive mechanism. This substitution eliminates complex mechanical linkages, bearings, and motors associated with traditional fans, reducing power consumption and enabling integration into power-constrained mobile devices while maintaining cooling effectiveness.
4Temperature
If traditional fans are used, then cooling effectiveness is improved, but noise increases
Solution Approach 1:
The ultrasonic vibration frequency is above the audible range for humans, eliminating the characteristic noise associated with traditional rotating fans. The high-frequency vibration drives fluid flow effectively while remaining inaudible, providing quiet operation suitable for mobile devices and noise-sensitive environments.
Solution Approach 2:
By replacing traditional rotating fan mechanisms with ultrasonic vibration, the system eliminates the mechanical noise generated by rotating blades, bearings, and air turbulence at audible frequencies. The ultrasonic frequency operation pushes the mechanical vibration beyond human hearing thresholds while maintaining cooling effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MEMS active cooling system effectively dissipates heat with minimal power consumption and noise, enabling higher performance and longer operation times for computing devices by efficiently transferring heat away from sensitive components, even in space-constrained environments.
Implementation Method 1
A micro-electro-mechanical systems (MEMS) active cooling system featuring a centrally anchored cooling element that undergoes vibrational motion to drive fluid towards heat-generating structures
Implementation Method 2
an adhesive support structure that enhances rotational motion
Data Source
AI summary
A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The support structure couples the cooling element to the bottom plate. At least one of the support structure is an adhesive support structure or the support structure undergoes rotational motion in response to the vibrational motion. The adhesive support structure has at least one lateral dimension defined by a trench in the cooling element or the bottom plate.