MEMS Micromechanical Arm Arrays With Micro-Spring Impact Damping
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Solution Overview
Problem
MEMS actuators, particularly those used in sensor-shift OIS, are vulnerable to impact damage, making it impractical to repair or replace broken micromechanical arms, which compromises the functionality of the device.
Innovation Solution
Incorporation of a first and second micromechanical arm array with interposed micro spring structures, including vertical and horizontal micro spring structures, to provide vibration isolation, resonance control, and damping, enhancing the robustness and impact resistance of the MEMS actuator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If micromechanical arms are made more robust to resist impact, then reliability improves, but device complexity increases due to additional protective structures
Solution Approach 1:
The patent incorporates micro spring structures between the micromechanical arms and the substrate before impact occurs. These pre-installed spring elements act as cushioning mechanisms that absorb impact energy when damage occurs, protecting the fragile micromechanical arms from breakage during accidental drops or impacts.
Solution Approach 2:
The micro spring structures serve as intermediary elements positioned between the micromechanical arms and the rigid substrate. This intermediary layer decouples the fragile arms from direct impact forces transmitted by the substrate, allowing the springs to deform and absorb energy while protecting the arms from damage.
2Reliability
If micro spring structures are added to protect micromechanical arms, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The protective system is segmented into distinct micro spring structures positioned at specific locations between the micromechanical arms and the substrate. This segmentation allows each spring element to be independently optimized and fabricated using standard MEMS processes, simplifying the overall manufacturing approach compared to creating a single complex protective structure.
Solution Approach 2:
The micro spring structures utilize parameter changes in the form of geometric design variations (such as spring constant, length, and thickness) to achieve the desired protective function. By adjusting these parameters, the protective capability can be tuned without fundamentally changing the manufacturing process, allowing optimization through design rather than process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The micro spring structures effectively absorb and dampen vibrations, reducing unwanted oscillations and protecting the micromechanical arms from collisions, thereby stabilizing the motion and maintaining the functionality of the MEMS actuator.
Implementation Method 1
The micro spring structures effectively absorb and dampen vibrations, reducing unwanted oscillations
Implementation Method 2
at least one micro spring structure configured to resist vibration of the micromechanical arms
Data Source
AI summary
MEMS devices having micro spring structures are provided. An example MEMS device includes a first micromechanical arm array including multiple first micromechanical arms spaced from each other in a first horizontal direction and a second micromechanical arm array including multiple second micromechanical arms spaced from each other in the first horizontal direction. The first and the second micromechanical arm arrays are interposed in the first horizontal direction. The MEMS device further includes a metal connection structure connected to each first micromechanical arm, and a vertical micro spring structure disposed between the metal connection structure and one of the second micromechanical arms. The vertical micro spring structure includes a first layer having a first coefficient of thermal expansion (CTE) and a second layer having a second CTE different from the first CTE. The second layer is bonded to the first layer.