MEMS ASIC Support Device with Ceramic Cavity Feedthroughs
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Solution Overview
Problem
Existing MEMS and ASIC component support devices face challenges in efficiently connecting and protecting these components while minimizing device footprint and avoiding the use of gels, particularly in providing reliable electrical and fluidic connections without wire tangles.
Innovation Solution
A device comprising a first layer with conductive traces and a second layer made of ceramic with a cavity and feedthroughs for housing and connecting MEMS or ASIC components, where the feedthroughs allow for electrical, electromagnetic, fluid, or force transmission, simplifying connections and reducing the need for wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonding connections are used to electrically connect MEMS component to other elements, then electrical connection is achieved, but device complexity and wire tangles increase
Solution Approach 1:
The patent combines the cavity structure with integrated feedthroughs that provide both mechanical support and electrical connection functions. The feedthroughs are embedded directly in the cavity walls, merging the housing and electrical connection elements into a single integrated structure, thereby eliminating the need for separate wire-bonding connections and reducing device complexity.
2Area of stationary object
If ceramic substrate is used for providing cavity, then gel-free device and reduced footprint are achieved, but wire-bonding connections are required for electrical connection
Solution Approach 1:
The patent integrates feedthroughs directly into the ceramic cavity structure, combining the mechanical housing function with the electrical connection function. This integration eliminates the need for separate wire-bonding connections while maintaining the compact footprint advantage of the ceramic substrate.
3Device complexity
If feedthrough is integrated in cavity, then electrical connection is simplified, but manufacturing precision requirements increase
Solution Approach 1:
The feedthroughs are pre-formed and positioned within the cavity structure during the manufacturing process, allowing for precise alignment and integration before final assembly. This preliminary positioning reduces the precision requirements for subsequent assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, gel-free device with simplified connections and reduced wire tangles, enhancing the protection and integration of MEMS and ASIC components while maintaining accuracy and ease of handling.
Implementation Method 1
The second layer has a feedthrough for transmission of at least one of an electrical signal, an electromagnetic signal, a fluid, and a force
Data Source
AI summary
A device including a first layer, a MEMS component and/or an ASIC component on the first layer, and a second layer having a cavity receiving the MEMS component and/or the ASIC component. The second layer has a feedthrough for transmission of at least one of an electrical signal, an electromagnetic signal, a fluid, and a force.