MEMS ASIC Integration via Direct Interconnect Cavity
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Solution Overview
Problem
Existing MEMS packages require a separate lid/cap element that increases package size, manufacturing complexity, and cost due to additional manufacturing steps.
Innovation Solution
Directly coupling MEMS with an interconnect to an ASIC, forming a cavity where the active side of the MEMS is inside, eliminates the need for a separate lid/cap, reducing package size, cost, and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate lid/cap element is used to protect MEMS, then protection of MEMS is improved, but package size increases and manufacturing complexity increases
Solution Approach 1:
The patent combines the lid/cap element with the ASIC package substrate into a single integrated structure. The ASIC package serves dual functions as both the mounting substrate for the MEMS device and as the protective lid/cap enclosure, eliminating the need for a separate lid component and reducing overall package complexity while maintaining protection of the MEMS sensitive circuitry.
2Reliability
If a separate lid/cap element is used to protect MEMS, then protection of MEMS is improved, but manufacturing cost increases
Solution Approach 1:
The ASIC package is designed to function as both the mounting substrate and the protective lid/cap enclosure. This integration eliminates the need for separate lid manufacturing and assembly operations, reducing the total number of manufacturing steps, materials required, and assembly operations, thereby lowering overall manufacturing cost while maintaining MEMS protection.
Solution Approach 2:
The ASIC package substrate is designed to perform multiple functions simultaneously: it serves as the mounting platform for the MEMS device, provides electrical interconnections through wire bonds, and acts as the protective lid/cap enclosure. This multi-functionality reduces the total component count and simplifies the bill of materials, leading to cost reduction.
3Reliability
If a separate lid/cap element is used, then protection of MEMS is improved, but manufacturing time increases
Solution Approach 1:
By integrating the lid/cap function into the ASIC package substrate, the patent eliminates separate manufacturing and assembly steps for a distinct lid component. The ASIC package is manufactured once and serves multiple functions, reducing the total cycle time and number of assembly operations required, thereby improving manufacturing productivity while maintaining protection of the MEMS device.
4Reliability
If MEMS is wire-bonded with separate lid/cap and ASIC, then electrical connection is achieved, but package size increases
Solution Approach 1:
The patent integrates the lid/cap enclosure function into the ASIC package substrate, eliminating the need for a separate lid component that would increase package volume. The wire bonds connect the MEMS device directly to the ASIC package, which serves as both the electrical interconnection platform and the protective enclosure, thereby achieving electrical connectivity without the additional volume penalty of a separate lid.
Data Source
AI summary
In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.