MEMS Microphone Stacked with ASIC for Compact Packaging
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Solution Overview
Problem
Conventional packaging methods for MEMS microphone components result in large overhead area ratios and inefficient use of space due to side-by-side chip arrangements, which can lead to mechanical and thermal issues affecting signal integrity.
Innovation Solution
A stacked arrangement of MEMS and semiconductor components with flip-chip mounting, where the MEMS component is mounted face-down on a carrier, allowing for mechanical protection and space-saving electrical contacting, and the semiconductor component covers the backside cavity to prevent environmental influences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chips are positioned side-by-side on the carrier, then electrical contacting is simplified, but the area overhead becomes large
Solution Approach 1:
The patent transitions from a two-dimensional side-by-side chip arrangement to a three-dimensional stacked arrangement. The MEMS chip is mounted face-down on the carrier while the ASIC is positioned above it, utilizing the vertical dimension to reduce the lateral footprint while maintaining electrical connectivity through plated-through contacts in the MEMS chip.
Solution Approach 2:
The ASIC is nested above the MEMS chip in a vertical stack configuration. The MEMS chip serves as a substrate for the ASIC, with the ASIC positioned in the space above the MEMS diaphragm structure, creating a compact nested arrangement that reduces overall component area.
2Reliability
If MEMS chip is mounted with backside on carrier, then cavity is closed, but lateral dimensions increase
Solution Approach 1:
Instead of mounting the MEMS chip with its backside on the carrier as in conventional packaging, the patent inverts the mounting orientation to face-down configuration. The front side with the diaphragm structure faces upward, allowing the cavity to remain open and accessible while the ASIC positioned above provides the necessary closure and protection.
3Reliability
If sound opening is in housing cover, then backside volume is formed, but component area increases
Solution Approach 1:
The patent utilizes the vertical dimension by positioning the ASIC above the MEMS chip to create the backside volume function. The sound opening can be located in various positions (carrier, cover, or MEMS chip) while the vertical stacking arrangement provides the necessary volume management without increasing lateral component area.
Data Source
AI summary
A component includes at least one MEMS component and at least one additional semiconductor component in a common housing having at least one access opening. On the front side of the MEMS component, at least one diaphragm structure is provided, which spans a cavity on the backside of the MEMS component. The housing includes a carrier, on which the MEMS component is mounted. The MEMS component is mounted, using its front side, on the carrier, so that there is a standoff between the diaphragm structure and the carrier surface. The at least one additional semiconductor component is connected to the backside of the MEMS component, so that the MEMS component and the semiconductor component form a chip stack.