MEMS ASIC Stack via Plated-Through Holes Eliminates Carrier Substrate

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Solution Overview

Problem

Existing MEMS sensor components require carrier substrates for mounting, limiting miniaturization and increasing the area requirement, which hinders integration into mobile devices and affects signal resolution due to longer electrical connections prone to disturbances.

Innovation Solution

The MEMS sensor component comprises an MEMS chip and an ASIC chip arranged one above the other with direct internal interconnection via plated-through holes, eliminating the need for a carrier substrate and minimizing electrical line length, thereby reducing signal disturbances and achieving compact size with improved signal resolution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If MEMS chip and ASIC chip are mounted on a carrier substrate, then the component can be assembled and interconnected, but the structural size and area requirement increase

Engineering Contradiction:

Improvestructural sizeVSAvoidcarrier substrate requirement

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent merges the carrier substrate function into one of the chips (either MEMS or ASIC chip serves as the carrier for the other chip). This eliminates the need for a separate carrier substrate, reducing the overall structural size and area requirement while maintaining the assembly and interconnection functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent makes one of the chips (MEMS or ASIC) serve multiple functions: both as an active component and as a carrier substrate for mounting the other chip. This multi-functionality reduces the total number of components needed and minimizes the structural footprint of the overall assembly.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If MEMS chip and ASIC chip are mounted on a carrier substrate, then the component can be assembled, but the electrical connection length increases causing signal disturbances

Engineering Contradiction:

Improvesignal resolutionVSAvoidelectrical connection length

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

By merging the carrier substrate function into one of the chips, the electrical connections between MEMS and ASIC chips are shortened. The chips are directly interconnected without requiring long trace connections through a separate carrier substrate, thereby reducing signal disturbances and improving signal resolution.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If carrier substrate is used for mounting, then the component can be assembled and interconnected, but the area requirement increases hindering integration into mobile devices

Engineering Contradiction:

Improveintegration capabilityVSAvoidarea requirement

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent combines the carrier substrate functionality into one of the chips, eliminating the need for a separate carrier substrate. This merging reduces the overall area requirement of the component, making it more suitable for integration into space-constrained mobile devices while maintaining assembly and interconnection capabilities.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

By making one chip serve as both an active component and a carrier substrate, the patent reduces the total area occupied by the component assembly. This multi-functional approach enables better integration into mobile devices with limited space availability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for miniaturized MEMS sensor components with reduced area requirements and enhanced signal quality by shortening electrical connections and eliminating the need for carrier substrates, facilitating cost-effective and efficient production for integration into mobile devices.

Implementation Method 1

The internal interconnection or at least one of the electrical contacts of the chips is interconnected with the external electrical terminal via the plated-through hole

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a frame that seals the interior of the MEMS sensor component in a lateral direction is arranged in said gap

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS9056760B2Miniaturized electrical component comprising an MEMS and an ASIC and production method

Publication Date: 2015.06.16 INVENSENSE INC

AI summary

The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.