MEMS Package Attachment Element Prevents Die Tilting
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Solution Overview
Problem
Inconsistent solder ball diameters cause MEMS dies to tilt during flip-chip connection, reducing performance, and adhesive flow into sensing openings affects MEMS pressure sensor performance in semiconductor devices.
Innovation Solution
The use of an attachment element, such as a silicon soft adhesive material, surrounding the sensing region and opening of the substrate, along with wire bonding to connect the MEMS device, prevents tilting and adhesive flow, while a support structure like a stage or recess controls attachment element thickness and position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flip-chip technique is used to connect MEMS die to substrate, then connection is achieved, but inconsistent solder ball diameters cause MEMS die tilting which reduces performance
Solution Approach 1:
A support structure (stage) is introduced as an intermediary element between the MEMS die and substrate. This stage provides a stable platform with consistent dimensions that mediates the connection process, eliminating the tilting problem caused by inconsistent solder ball diameters while still enabling flip-chip connection.
Solution Approach 2:
The invention changes the geometric parameters of the support structure (stage) to optimize performance. The stage has specific length, width, and thickness parameters that are controlled to ensure proper mechanical support and alignment, transforming the connection process from direct die-to-substrate to die-to-stage-to-substrate with controlled dimensional parameters.
2Strength
If adhesive is applied between MEMS die and substrate, then bonding is achieved, but adhesive flows into sensing opening which affects MEMS pressure sensor performance
Solution Approach 1:
The support structure (stage) acts as a physical barrier and intermediary that prevents adhesive from flowing into the sensing opening. By placing the stage between the adhesive application area and the sensing region, it mediates the bonding process while blocking the harmful adhesive intrusion that would otherwise affect pressure sensor performance.
Solution Approach 2:
The invention segments the bonding area by introducing the support structure that divides the space between MEMS die and substrate. This segmentation creates distinct regions: one for adhesive bonding and another for sensing, preventing adhesive contamination of the sensing opening while maintaining bonding strength in the designated areas.
3Volume of moving object
If MEMS device size is reduced to meet miniaturization demands, then product size decreases, but space occupation and packaging complexity become challenges
Solution Approach 1:
The invention merges multiple functions into the support structure (stage): it provides mechanical support, ensures alignment, prevents adhesive intrusion, and facilitates connection all in a single integrated component. This merging simplifies the overall packaging structure and assembly process while accommodating miniaturized MEMS devices, reducing the complexity that would otherwise arise from size reduction.
Data Source
AI summary
The present disclosure relates to an electronic device. The electronic device comprises a substrate, a micro-electromechanical systems (MEMS) device and an attachment element. The substrate defines an opening penetrating the substrate. The MEMS device has an active surface facing away from the substrate and a sensing region facing toward the opening. The attachment element is disposed on the substrate and surrounding the opening and the sensing region of the MEMS device.