MEMS Microphone Back Volume Extension via Encapsulation

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Solution Overview

Problem

Conventional MEMS microphones have a limited back-volume, which restricts their performance and integration capabilities.

Innovation Solution

The solution involves creating a MEMS structure with an extended back volume by using an encapsulation material that defines the back volume, allowing for increased space without enlarging the membrane, and a manufacturing process that forms the back volume after encapsulation, enabling easier integration and handling of MEMS microphones.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of stationary object

If the back volume is defined by the substrate of the silicon microphone, then the MEMS microphone can be manufactured with a compact structure, but the back volume is limited and restricts performance

Engineering Contradiction:
Improveback volumeVSAvoidperformance
Core Design Contradiction:
Volume of stationary objectVSAdaptability or versatility

Solution Approach 1:

The patent extends the back volume beyond the traditional substrate boundary by utilizing the encapsulation material to create additional volume in the vertical dimension. The back volume is now defined by the encapsulation material rather than being constrained to the substrate area, effectively adding space in the Z-direction while maintaining a compact footprint in the X-Y plane.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The encapsulation material serves dual functions: it provides mechanical protection for the MEMS device and simultaneously defines the back volume. This multi-functionality eliminates the need for separate structures to define the back volume, allowing the same material to fulfill both protective and volumetric roles.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Volume of stationary object

If the membrane size is increased to improve performance, then the back volume can be increased, but the cost increases due to the expensive membrane

Engineering Contradiction:
Improveback volumeVSAvoidmembrane material
Core Design Contradiction:
Volume of stationary objectVSQuantity of substance

Solution Approach 1:

The patent applies local quality by maintaining the membrane at its original optimal size for cost-effectiveness while creating additional back volume through the encapsulation material. The back volume extension is achieved locally in the region surrounding the membrane, not by enlarging the membrane itself, thus preserving the cost benefits of the original membrane dimensions.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Instead of increasing back volume by enlarging the membrane area (X-Y plane), the patent extends the back volume vertically (Z-direction) using the encapsulation material. This dimensional shift allows volume increase without requiring larger membrane materials, thereby avoiding the associated cost increase.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If the back volume is extended beyond the substrate area, then performance and integration capabilities are improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveintegration capabilitiesVSAvoidmanufacturing process
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the encapsulation process with the back volume definition function. By using the same encapsulation material and process to both protect the MEMS device and define the extended back volume, the manufacturing process does not require additional separate steps for volume definition, thus limiting the increase in manufacturing complexity despite the functional enhancement.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation material performs multiple functions simultaneously: mechanical protection, hermetic sealing, and back volume definition. This multi-functionality reduces the need for additional manufacturing steps that would otherwise be required to create and define the extended back volume, thereby limiting the increase in manufacturing process complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS9593009B2Apparatus comprising and a method for manufacturing an embedded MEMS device
Publication Date: 2017.03.14 INFINEON TECHNOLOGIES AG
  • US9593009B2 patent drawing
  • US9593009B2 patent drawing
  • US9593009B2 patent drawing

AI summary

A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.