MEMS Metal Beam Magnetic Coating via Electroless Deposition

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for forming magnetic cores in MEMS inductors and transformers face challenges such as the need for external electrodes and seed layers in electroplating, low deposition rates and non-conformal coverage in sputtering, and high stress on large wafers.

Innovation Solution

The method involves forming a metal layer on a wafer substrate and electrolessly depositing a soft magnetic material on the metal layer, which allows for seamless coverage and reduced stress on the wafer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If electroplating is used to deposit soft magnetic material, then magnetic core can be formed, but external electrodes and seed layers are required increasing device complexity

Engineering Contradiction:

Improvemagnetic core formationVSAvoidexternal electrodes and seed layers

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts and removes the requirement for external electrodes and thick seed layers from the electroplating process by using electroless deposition instead, which achieves uniform magnetic core deposition without these additional components

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the electrochemical electroplating process with an electroless chemical deposition process, substituting a mechanical/electrical system with a chemical field-based system that achieves the same magnetic core formation without external electrodes

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If sputtering is used to deposit soft magnetic material, then magnetic film can be formed, but deposition rate is low and coverage is non-conformal

Engineering Contradiction:

Improvemagnetic film formationVSAvoiddeposition rate and coverage uniformity

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the physical vapor deposition sputtering process with electroless chemical deposition, substituting a mechanical field-based process with a chemical field-based process that enables conformal coverage and higher deposition rates

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the deposition mechanism from physical sputtering to chemical reduction, altering the fundamental parameters of the deposition process to achieve improved coverage uniformity and deposition rate

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If thick film sputtering is used to deposit magnetic material, then magnetic core can be formed, but high vacuum and frequent maintenance are required increasing manufacturing complexity

Engineering Contradiction:

Improvemagnetic core formationVSAvoidvacuum requirements and system maintenance

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces the vacuum-based sputtering process with electroless chemical deposition that can be performed in atmospheric conditions, eliminating the need for high vacuum systems and frequent maintenance

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent transitions from requiring high vacuum (inert environment) to allowing atmospheric deposition, using electroless chemistry that operates effectively in ambient conditions without special atmosphere requirements

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

4Manufacturing precision

If conventional deposition methods are used on large wafers, then magnetic material can be deposited, but high stress is applied to the wafer

Engineering Contradiction:

Improvemagnetic material depositionVSAvoidwafer stress

Core Design Contradiction:

Manufacturing precisionVSStress or pressure

Solution Approach 1:

The patent replaces conventional electroplating and sputtering with electroless deposition, which deposits material through chemical reduction without the high stress associated with other methods, particularly on large wafers

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The electroless deposition process is self-catalytic, where the deposited metal catalyzes further deposition automatically, eliminating the need for external current distribution systems that create stress on large wafers

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient and stress-reduced deposition of soft magnetic materials on large wafers, improving the integration and manufacturing of MEMS inductive components.

Implementation Method 1

electrolessly depositing a soft magnetic material on the metal layer

Methodology Applied

Scientific EffectElectroless deposition: Chemical Bonding

Data Source

PatentUS12240753B2Micro-electromechanical device having a soft magnetic material electrolessly deposited on a palladium layer coated metal beam

Publication Date: 2025.03.04 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.